
PAGE . 1
STAD-FEB.21.2005
DATA SHEET
FEATURES
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound.
Exceeds environmental standards of MIL-S-19500/228
Low power loss, high efficiency.
Low forwrd voltge, high current capability
High surge capacity.
For use in low voltage,high frequency inverters free wheeling , and polarlity
protection applications.
Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb
Pb free: 99% Sn above
SB820FCT~SB8150FCT
ISOLATION SCHOTTKY BARRIER RECTIFIERS
VOLTAGE
20 to 150 Volts
ITO-220AB
Unit : inch (mm)
.189(4.8)
.165(4.2)
.406(10.3)
.381(9.7)
.130(3.3)
.114(2.9)
.114(2.9)
.098(2.5)
.071(1.8)
.055(1.4)
.055(1.4)
.039(1.0)
.035(0.9)
.011(0.3)
(2.55)
(2.55)
Positive CT
AC
AC
.1
.1
.032(.8)
MAX
.
.
.
.
.
.134(3.4)
.118(3.0)
.
.
.
.
CURRENT
8 Amperes
MECHANICAL DATA
Case: ITO-220AB full molded plastic package
Terminals: Lead solderable per MIL-STD-202G, Method 208
Polarity: As marked.
Mounting Position: Any
Weight: 0.08 ounces, 2.24grams.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
R
E
T
E
M
A
R
A
P
L
O
B
M
Y
S
0
2
T
8
B
F
S
C
0
3
T
8
B
F
S
C
0
4
T
8
B
F
S
C
0
5
T
8
B
F
S
C
0
6
T
8
B
F
S
C
0
8
T
8
B
F
S
C
0
0
1
T
8
C
B
F
S
0
5
1
T
8
C
B
F
S
S
T
N
U
e
g
a
V
e
s
e
v
e
R
k
a
e
P
t
e
c
e
R
m
u
m
i
a
M
V
RRM
0
2
0
3
0
4
0
5
0
6
0
8
0
0
1
0
5
1
V
e
g
a
V
S
M
R
m
u
m
i
a
M
V
RMS
4
1
1
2
8
2
5
3
2
4
6
5
0
7
5
0
1
V
e
g
a
V
g
n
c
o
B
C
D
m
u
m
i
a
M
V
DC
0
2
0
3
0
4
0
5
0
6
0
8
0
0
1
0
5
1
V
)
m
m
5
5
7
3
t
e
C
d
a
O
C
w
r
0
o
0
F
1
e
g
c
a
e
t
v
A
m
h
n
u
m
e
i
a
a
M
e
T
d
=
I
AV
8
A
-
e
n
d
o
f
h
h
m
e
C
E
n
D
E
s
m
J
d
3
o
t
e
C
e
n
o
e
g
S
s
o
p
d
a
m
i
e
w
r
o
u
F
s
k
e
a
v
e
a
P
w
)
a
d
d
e
p
I
FSM
0
5
1
A
A
0
t
e
g
a
V
d
a
w
r
o
F
m
u
m
i
a
M
V
F
5
5
5
7
5
8
2
9
V
5
0
2
1
=
=
A
A
T
T
t
g
e
C
a
V
e
g
s
e
n
c
v
e
R
o
B
C
C
D
D
m
d
u
m
i
a
R
M
t
O
C
0
e
e
O
C
I
R
5
5
0
A
m
c
n
a
e
R
l
m
r
e
h
T
l
c
y
T
e
R
θ
C
J
6
O
W
/
C
g
n
a
R
e
e
p
m
e
T
n
o
n
u
J
g
n
e
p
O
T
J
5
2
1
+
o
0
5
O
C
g
n
a
R
e
e
p
m
e
T
e
g
a
o
S
T
J
T
STG
0
5
1
+
o
0
5
O
C
Note.
Both Bonding and Chip structure are available.