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參數資料
| 型號： | SBU6D |
| 元件分類： | 橋式整流 |
| 英文描述： | 6 A, 200 V, SILICON, BRIDGE RECTIFIER DIODE |
| 封裝： | PLASTIC, SBU, 4 PIN |
| 文件頁數： | 1/2頁 |
| 文件大小： | 73K |
| 代理商： | SBU6D |
E23
NOTES:
Operating and Storage Temperature Range
TJ ,TSTG
°C
-55 to +150
3.01 06sbu
(1) Bridge mounted on 2.6"x 1.4"x 0.06" thick (6.5cmx 3.5cmx 0.15cm) aluminum plate
(2) Bridge mounted on PC Board
0.375" (9.5mm)
(3)
with 0.5" sq. (12mm sq.) copper pads and bridge lead length of
Bolt bridge on heat sink with #6 screw, using silicon thermal compound between bridge and mounting surface for maximum heat transfer.
MECHANICAL DATA
FEATURES
Data Sheet No. BSBU-600-1C
MECHANICAL SPECIFICATION
Case: Molded plastic, U/L Flammability Rating 94V-0
Terminals: Round silver plated pins
Soldering: Per MIL-STD 202 Method 208 guaranteed
Polarity: Marked on case
Mounting Position: Any. Max. mounting torque=5 in lb
Weight: 0.3 Ounces (8 Grams)
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
MAXIMUM RATINGS& ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified. Single phase, 60Hz, resistive or inductive load. For capacitive loads, derate current by 20%.
Peak Forward Surge Current. Single 60Hz Half-Sine Wave
Superimposed on Rated Load (JEDEC Method). T = 150 C
J
O
Maximum Forward Voltage (Per Diode) at6 Amps DC
VOLTS
AMPS
VFM
IFSM
250
0.95 (Typical< 0.90)
Typical Thermal Resistance
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
IRM
R
θJA
R
θJC
°C/W
A
mA
@ T = 25 C
A
o
@ T = 100 C
A
o
5 (Typical< 0.5 A)
1
16.0
3.1
SBU PACKAGE SHOWN ACTUAL SIZE
B1
L
L1
D3
D
C2
D2
D1
C1
A1
D
A
B
+
_
C
+
_
SERIES SBU6A- SBU6M
Average Forward Rectified Current
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
IO
VRMS
VRRM
VRM
SYMBOL
RATINGS
UNITS
VOLTS
SBU
50
100
200
400
1000
35
70
140
280
700
6
600
800
50
100
200
400
1000
600
800
420
560
6A
6B
6D
6G
6J
6K
6M
UL RECOGNIZED- FILE #E124962
5.59
4.7
0.185
0.220
1.22
1.32
0.048
0.052
6.6
7.1
0.260
0.280
0.205
5.2
4.57
0.180
A
A1
B
B1
0.895
22.7
23.24
0.915
C
C1
4.2
0.165
0.185
L
L1
1.0
25.4
n/a
C2
D
D1
D2
D3
0.140
0.160
3.6
4.1
0.760
19.3
10.3
11.3
0.405
0.455
0.065
0.085
1.7
2.2
0.660
0.700
16.5
17.8
0.180
0.260
4.57
6.8
4.7
MILLIMETERS
INCHES
MIN
MAX
SYM
T = 40 C (Note 2)
A
o
T = 100C (Notes 1, 3)
C
o
Junction to Case (Note 3)
Junction to Ambient (Note 2)
BUILT-IN STRESS RELIEF MECHANISM FOR
SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 250 AMPS PEAK
IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
THRU-HOLE FOR EASY HEAT SINK MOUNTING
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical< 2%, Max.< 10% of Die Area)
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