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參數(shù)資料
| 型號(hào)： | SFH4056-U |
| 元件分類(lèi)： | 紅外LED |
| 英文描述： | 1.1 mm, 1 ELEMENT, INFRARED LED, 860 nm |
| 封裝： | 3.20 X 1.60 MM, 1 MM HEIGHT, ROHS COMPLIANT PACKAGE-2 |
| 文件頁(yè)數(shù)： | 8/9頁(yè) |
| 文件大小： | 336K |
| 代理商： | SFH4056-U |
2010-11-09
8
SFH 4056
Ltbedingungen
Vorbehandlung nach JEDEC Level 3
Soldering Conditions
Preconditioning acc. to JEDEC Level 3
Reflow Ltprofil für bleifreies Lten
(nach J-STD-020-D.01)
Reflow Soldering Profile for lead free soldering
(acc. to J-STD-020-D.01)
Pb-Free (SnAgCu) Assembly
Profile Feature
Recommendation
Max. Ratings
Ramp-up Rate to Preheat*
)
25°C to 150°C
2°C / sec
3°C / sec
Time t
s from TSmin to TSmax
(150°C to 200°C
100s
min. 60sec max. 120sec
Ramp-up Rate to Peak*
)
T
Smax to TP
2°C / sec
3°C / sec
Liquidus Temperture T
L
217°C
Time t
L above TL
80sec
max. 100sec
Peak Temperature T
P
245°C
max. 260°C
Time t
P within 5°C of the specified peak
temperature T
P - 5K
20sec
min. 10sec max. 30sec
Ramp-down Rate*
T
P to 100°C
3°C / sec
6°C / sec maximum
Time 25°C to Peak temperature
max. 8 min.
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation
ΔT/Δt: Δt max. 5 sec; fulfillment for the whole T-range
0
s
OHA04525
50
100
150
200
250
300
50
100
150
200
250
300
t
T
C
S
t
P
t
Tp
240 C
217 C
245 C
25 C
L
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