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參數資料
| 型號： | SFH5410-36-Z |
| 元件分類： | 光電元器件 |
| 英文描述： | LOGIC OUTPUT PHOTO DETECTOR |
| 封裝： | ROHS COMPLIANT PACKAGE-3 |
| 文件頁數： | 8/8頁 |
| 文件大小： | 269K |
| 代理商： | SFH5410-36-Z |
2008-10-06
8
SFH 5410
Ltbedingungen
Vorbehandlung nach JEDEC Level 4
Soldering Conditions
Preconditioning acc. to JEDEC Level 4
Reflow Ltprofil für bleifreies Lten
(nach J-STD-020C)
Reflow Soldering Profile for lead free soldering
(acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLA0687
0
T
t
C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50
100
150
200
250
300
Ramp Down
6 K/s (max)
3 K/s (max)
25 C
30 s max
260 C
+0 C
-5 C
245 C ±5 C
240 C
255 C
217 C
Maximum Solder Profile
Recommended Solder Profile
235 C -0 C
+5 C
Minimum Solder Profile
10 s min
min. condition for IR Reflow Soldering:
solder point temperature
≥ 235 °C for at least 10 sec.
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