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參數(shù)資料
型號: SI5475DC-T1
廠商: Vishay Intertechnology,Inc.
英文描述: P-Channel 12-V (D-S) MOSFET
中文描述: P溝道12 V的(副)MOSFET的
文件頁數(shù): 1/4頁
文件大小: 109K
代理商: SI5475DC-T1
Si5475DC
Vishay Siliconix
Document Number: 71324
S-21251—Rev. B, 05-Aug-02
www.vishay.com
1
P-Channel 12-V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V)
r
DS(on)
(
)
I
D
(A)
0.031 @ V
GS
= --4.5 V
--7.6
--12
0.041 @ V
GS
= --2.5 V
--6.6
0.054 @ V
GS
= --1.8 V
--5.8
1206-8 ChipFE
T
t
D
D
D
G
D
D
D
S
1
S
G
D
P-Channel MOSFET
Bottom View
Marking Code
BF
XX
Lot Traceability
and Date Code
Part #
Code
Ordering Information:
Si5475DC-T1
ABSOLUTE MAXIMUM RATINGS (T
A
= 25
_
C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Unit
Drain-Source Voltage
V
DS
--12
V
Gate-Source Voltage
V
GS
8
T
A
= 25
_
C
I
D
--7.6
--5.5
Continuous Drain Current (T
J
= 150
_
C)
a
T
A
= 85
_
C
--3.5
--3.9
A
Pulsed Drain Current
Continuous Source Current
a
I
DM
I
S
20
--2.1
--1.1
Maximum Power Dissipation
a
T
A
= 25
_
C
T
A
= 85
_
C
P
D
2.5
1.3
W
1.3
0.7
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
b, c
T
J
, T
stg
--55 to 150
_
C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient
t A bi
a
t
5 sec
R
thJA
40
50
Steady State
80
95
_
C/W
Maximum Junction-to-Foot (Drain)
Steady State
R
thJF
15
20
Notes
a.
b.
Surface Mounted on 1” x 1” FR4 Board.
See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singula-
tion process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder inter-
connection.
Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
c.
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