
SM537-1 ADSL Line Transformers
Features
■
For use with Analog Device’s
AD20msp930 ADSL chipset (CO)
■
Excellent Total Harmonic Distortion
(THD) performance
■
SMT and small size package
■
Designed to meet UL1950 and EN60950
supplementary insulation requirements
for operating voltages up to 250 Vrms
■
Operating temperature -40 °C to +85 °C
■
Lead free version available (see How to
Order)
■
Lead free versions are RoHS compliant*
Applications
■
ADSL - Analog AD20msp930
Electrical Specifications @ 25
°
C
Turns Ratio
(10-7):(1-4) ..........................1:1.1 ±2 %
OCL @ 10 kHz, 0.1V
(1-4) with (2-3) shorted....2.03 mH min.
(10-7) with (8-9) shorted..1.75 mH min.
Leakage Inductance @ 100 kHz 0.1 V
(10-7) with (2-3), (1-4), (8-9) shorted
..........................................7.5 μH max.
Longitudinal Balance
10 kHz to 1.1 MHz ..............50 dB min.
Insertion Loss @ 300 kHz............<0.5 dB
Isolation Voltage ............1500 Vrms max.
Load Resistance ............................100
DC Resistance
(1-4) with (2-3) shorted......1.30
max.
(10-7) with (8-9) shorted....1.50
max.
THD Linearity @ 30 kHz..........-80 dB typ.
Application..........................................CO
Product Dimensions
Electrical Schematic
DIMENSIONS ARE:
MM
(INCHES)
TOLERANCE: ±
0.25
(.010)
SM537-1
(DATECODE)
5
4
3
2
1
6
7
8
9
10
.711
±
.050
(.028
±
.002)
Recommended PAD layout
10 PLCS.
1.30
±
.050
(.051
±
.002)
10 PLCS.
13.46
(.530)
MAX.
10.00
(.394)
MAX.
10.00
(.394)
17.65
(.695)
MAX.
13.50
(.531)
MAX.
12.32
(.485)
MAX.
12.07
(.475)
MAX.
2.50
(.098)
2.50
(.098)
15.37
(.605)
2.54
(.100)
0.13
(.005)
10 SURFACES
10
8
9
7
1
Line
Chip
1.1 : 1
3
2
4
Packaging Specifications
Tape & Reel* ........................200 pcs./reel
*”E” suffix at end of part number
designates tape & reel packaging, e.g.
SM537-1E.
S571
*RHAVALABE
VRSONS
How to Order
SM537-1E __
Model
Termination
Blank = Tin-lead
L = Tin only (lead free)
03/05
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.