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參數(shù)資料
| 型號： | SN-24D01-C |
| 廠商： | FUJITSU COMPONENT LTD |
| 元件分類： | 繼電器，輸入/輸出模塊 |
| 英文描述： | TRANSISTOR OUTPUT SOLID STATE RELAY, 2500 V ISOLATION-MAX |
| 封裝： | 20 X 5 MM, 17 MM HEIGHT, ROHS COMPLIANT, ULTRA SLIM PACKAGE-4 |
| 文件頁數(shù)： | 10/10頁 |
| 文件大小： | 432K |
| 代理商： | SN-24D01-C |
9
SN SERIES
1. General Information
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Relays produced after the specific date code that is indicated on each data sheet are lead-free
now.Mostofoursignalandpowerrelaysarelead-free.PleaserefertoLead-FreeStatusInfo.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
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LeadfreesolderpastecurrentlyusedinrelaysisSn-3.0Ag-0.5Cu.
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AllsignalandmostpowerrelaysalsocomplywithRoHS.Pleaserefertoindividualdata
sheets.RelaysthatareRoHScompliantdonotcontainthe5hazardousmaterialsthat
arerestrictedbyRoHSdirective(lead,mercury,chromiumIV,PBB,PBDE).
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It has been verified that using lead-free relays in leaded assembly process will not cause any
problems(compatible).
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“LF”ismarkedoneachouterandinnercarton.(Nomarkingonindividualrelays).
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To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
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Wewillshipleadedrelaysaslongastheleadedrelayinventoryexists.
Note:CadmiumwasexemptedfromRoHSonOctober21,2005.(AmendmenttoDirective2002/95/EC)
2. Recommended Lead Free Solder Profile
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RecommendedsolderpasteSn-3.0Ag-0.5Cu.
RoHS Compliance and Lead Free Relay Information
Reflow Solder condtion
3. Moisture Sensitivity
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MoistureSensitivityLevelstandardisnotapplicabletoelectromechanicalrealys.
4. Tin Whisker
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DippedSnAgCusolderisknownaslowrisktinwhisker.Noconsiderablelengthwhiskerwasfoundbyourin
housetest.
We highly recommend that you confirm your actual solder conditions
Flow Solder condtion:
Pre-heating:
maximum 120C
Soldering:
dipwithin5sec.at
260C soler bath
Solder by Soldering Iron:
SolderingIron
Temperature: maximum 360C
Duration:
maximum3sec.
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