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參數資料
| 型號： | SN54LVT16501WD |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 通用總線功能 |
| 英文描述： | 3.3-V ABT 18-BIT UNIVERSAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS |
| 中文描述： | 的3.3V ABT生根粉18位通用總線收發3態輸出 |
| 文件頁數： | 1/12頁 |
| 文件大小： | 203K |
| 代理商： | SN54LVT16501WD |
SN54LVT16501, SN74LVT16501
3.3-V ABT 18-BIT UNIVERSAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS147G – MAY 1992 – REVISED NOVEMBER 1996
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low-Static Power
Dissipation
Members of the Texas Instruments
Widebus
Family
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
CC
)
Support Unregulated Battery Operation
Down to 2.7 V
UBT
(Universal Bus Transceiver)
Combines D-Type Latches and D-Type
Flip-Flops for Operation in Transparent,
Latched, or Clocked Mode
Typical V
OLP
(Output Ground Bounce)
< 0.8 V at V
CC
= 3.3 V, T
A
= 25
°
C
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model
(C = 200 pF, R = 0)
Latch-Up Performance Exceeds 500 mA
Per JEDEC Standard JESD-17
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Support Live Insertion
Distributed V
CC
and GND Pin Configuration
Minimizes High-Speed Switching Noise
Flow-Through Architecture Optimizes
PCB Layout
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
description
The ’LVT16501 are 18-bit universal bus transceivers designed for low-voltage (3.3-V) V
CC
operation, but with
the capability to provide a TTL interface to a 5-V system environment.
Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA),
and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when
LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is
low, the A-bus data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high,
the outputs are active. When OEAB is low, the outputs are in the high-impedance state.
Copyright
1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and UBT are trademarks of Texas Instruments Incorporated.
SN54LVT16501 . . . WD PACKAGE
SN74LVT16501 . . . DGG OR DL PACKAGE
(TOP VIEW)
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OEAB
LEAB
A1
GND
A2
A3
V
CC
A4
A5
A6
GND
A7
A8
A9
A10
A11
A12
GND
A13
A14
A15
V
CC
A16
A17
GND
A18
OEBA
LEBA
GND
CLKAB
B1
GND
B2
B3
V
CC
B4
B5
B6
GND
B7
B8
B9
B10
B11
B12
GND
B13
B14
B15
V
CC
B16
B17
GND
B18
CLKBA
GND
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