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參數(shù)資料
型號(hào): SND
廠商: Bourns Inc.
英文描述: DIP Switch (Machine Insertable Type)
中文描述: DIP開關(guān)(機(jī)可插入式)
文件頁(yè)數(shù): 1/2頁(yè)
文件大小: 221K
代理商: SND
SND Series DIP Switch (Machine Insertable Type)
Features
Double contacts offer high reliability
Low contact resistance
Self-clean on contact area
Splay terminals allow for automatic
insertion by IC insertion machine
Straight terminals are available for
manual insertion
RoHS compliant*
Electrical Characteristics
Electrical Life ............2,000 operations min.
per switch, 24 VDC, 25 mA
Non-Switching Rating ......100 mA, 50 VDC
Switching Rating ................25 mA, 24 VDC
Contact Resistance
........................50 milliohms max. at initial
..............100 milliohms max. after life test
Insulation Resistance....100 megohms min.
Dielectric Strength ............500 VAC/minute
Capacitance ..................5 pf max. between
adjacent closed switch
Circuit ....................Single pole single throw
Environmental Characteristics
Mechanical Life..2,000 operations per switch
Operation Force......................1,000 g max.
Stroke ..............................................1.0 mm
Operating Temp. Range....-20 °C to +85 °C
Storage Temperature........-40 °C to +85 °C
Vibration Test......................MIL-STD-202F,
Method 201A
Frequency ................10-55-10 Hz/minute
Directions ................X,Y,Z, three mutually
perpendicular directions
Time......................2 hours each direction.
High reliability
Shock Test ..........................MIL-STD-202F,
Method 213B, Condition A
Gravity ..........50 G (peak value), 11 msec
Direction & Times....................6 sides and
3 times in each direction.
High reliability
Physical Characteristics
Base and Cover Materials
......................UL94V-0 high-temperature
thermoplastic PPS
Color ................................................Black
Actuator Materials................UL94V-0 nylon
thermoplastic
Color ................................................White
Contact Materials ....................Alloy copper
Terminal Materials ..............................Brass
Contact Plating Materials
......................3 micro inches gold plating
over 40 micro inches nickel
Terminal Plating Materials....................Gold
Wave Soldering Process
....Recommended solder temp. at 260 °C
(500 °F) max., 5 sec.
Hand Soldering Process
................Use a soldering iron of 30 watts
or less, controlled at 320 °C (608 °F) for
approx. 2 sec. while applying solder
Standard Packaging
......IC tubes/all poles in the “off” position
How to Order
SND X - 1 S - X
Model
Actuator
X = Raised Actuator
R = Recessed Actuator
Number of Positions
1 = 1 Position
2 = 2 Positions
3 = 3 Positions
4 = 4 Positions
5 = 5 Positions
6 = 6 Positions
7 = 7 Positions
8 = 8 Positions
9 = 9 Positions
10 = 10 Positions
12 = 12 Positions
Terminal Type
S = Splay (Machine Insertion Type)
H = Straight (Manual Insertion Type)
Seal
X = Standard (Not Sealed)
T = Top Tape Sealed
(“R” actuator only, excluding 1 position)
For best results, keep all switch contacts in their “off”
position for all operations.
A +.006/ -0
(A + .0002/-0)
1.9
(.075)
6.20
(.244)
ON
DIP
1
2
3
4
5
6
7
8
3.60
4.30
(.169)
MIN.
0.50
(.020)
1.74
(.069)
2.54
(.100)
TYP.
B
7.62 ± 0.50
(.30 ± .020)
9.84 ± 0.50
(.387 ± .020)
SNDR SERIES
1.0
(.039)
7.80
(.307)
0.25
(.010)
0.70
(.028)
SNDX SERIES
RECOMMENDED PCB LAYOUT
B ± 0.10 = 2.54 x (P-1)
(B ± .004 = .100 x (P-1)
7.62 ± 0.10
(.300 ± .004)
0.97 ± 0.05
SCHEMATIC (TYP.)
1-12 POSITIONS AVAILABLE
MODEL NO.
SND-12
SND-10
SND-9
SND-8
SND-7
SND-6
SND-5
SND-4
SND-3
SND-2
SND-1
POS.
12
10
9
8
7
6
5
4
3
2
1
DIM. A
31.42 (1.237)
26.34 (1.037)
23.80 (.937)
21.26 (.837)
18.72 (.737)
16.18 (.637)
13.64 (.537)
11.10 (.437)
8.56 (.337)
6.02 (.237)
3.48 (.137)
DIM. B
26.94 (1.100)
22.86 (.900)
20.32 (.800)
17.78 (.700)
15.24 (.600)
12.70 (.500)
10.16 (.400)
7.62 (.300)
5.08 (.200)
2.54 (.100)
SND Series Dimensions
Product Dimensions
DIMENSIONS: (IN)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Reflow Soldering Profile
T
°
C
Time (Seconds)
275
30-40 Sec.
120
°
C
225
175
125
75
250
20
40
60
80
100 120 140 160 180 200
80-90 Sec.
Sec.
Sec.
180
°
C
240
°
C
*RHSCOMPIAN
The SND Series is currently available,
although not recommended for new
designs.
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