
SCLS400G APRIL 1998 REVISED APRIL 2005
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
2-V to 5.5-V V
CC
Operation
Max t
pd
of 7.5 ns at 5 V
Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25
°
C
Typical V
OHV
(Output V
OH
Undershoot)
>2.3 V at V
CC
= 3.3 V, T
A
= 25
°
C
Support Mixed-Mode Voltage Operation on
All Ports
Contain Four Flip-Flops With Double-Rail
Outputs
Applications Include:
Buffer/Storage Registers
Shift Registers
Pattern Generators
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
description/ordering information
The ’LV175A devices are quadruple D-type
flip-flops designed for 2-V to 5.5-V V
CC
operation.
These devices have a direct clear (CLR) input and
feature complementary outputs from each
flip-flop.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC D
Tube of 40
SN74LV175AD
LV175A
Reel of 2500
SN74LV175ADR
SOP NS
Reel of 2000
SN74LV175ANSR
74LV175A
40
°
C to 85
°
C
SSOP DB
Reel of 2000
SN74LV175ADBR
LV175A
Tube of 90
SN74LV175APW
TSSOP PW
Reel of 2000
SN74LV175APWR
LV175A
Reel of 250
SN74LV175APWT
TVSOP DGV
Reel of 2000
SN74LV175ADGVR
LV175A
CDIP J
Tube of 25
SNJ54LV175AJ
SNJ54LV175AJ
55 C to 125 C
CFP W
LCCC FK
Tube of 150
Tube of 55
SNJ54LV175AW
SNJ54LV175AFK
SNJ54LV175AW
SNJ54LV175AFK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
SN54LV175A . . . J OR W PACKAGE
SN74LV175A . . . D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
SN54LV175A . . . FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CLR
1Q
1Q
1D
2D
2Q
2Q
GND
V
CC
4Q
4Q
4D
3D
3Q
3Q
CLK
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
4Q
4D
NC
3D
3Q
1Q
1D
NC
2D
2Q
1
C
N
C
3
4
2
G
N
V
C
NC No internal connection
Copyright
2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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