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參數(shù)資料
| 型號(hào)： | SP8714MPBP |
| 廠商： | Zarlink Semiconductor Inc. |
| 英文描述： | 2100 MHz Very Low Current Multi-Modulus Divider |
| 中文描述： | 2100兆赫非常低的電流多模數(shù)分頻器 |
| 文件頁(yè)數(shù)： | 1/9頁(yè) |
| 文件大小： | 490K |
| 代理商： | SP8714MPBP |
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SP8714
SP8714
March 2006
The SP8714 is a switchable divide by 32/33, 64/65
programmable divider which is guaranteed to operate up to
2100MHz. It will operate from a supply of 2.7V to 5.25V and
requires typically 6.8mA (including the output current). It also
features a power down facility for battery economy.
The RF inputs are internally biased and should be
capacitively coupled to the signal source. The output is
designed to interface with CMOS synthesisers.
FEATURES
I
Operation to 2100MHz
I
Very Low Power
I
Single Supply Operation 2.7V to 5.25V
I
Power Down Facility for Battery Economy
I
Latched Modulus Control Input
I
Push Pull Output Drive
I
ESD Protection on All Pins
APPLICATIONS
I
Cellular Telephones
I
Cordless Telephones
ESD precautions must be observed
Fig. 1 Pin connections - top view
MP8
1 8
2 7
3 6
4 5
RF INPUT
POWER DOWN
MODULUS CONTROL
VEE
RF INPUT
V
RATIO SELECT
OUTPUT
BIAS
VCC
2
7
5
250K
NOMINAL
4
CK
D
Q
6
3
VCC
VEE
1
8
VEE
POWER
DOWN
OUTPUT
MC
RS
RF
INPUT
(CLOCK)
DIVIDE BY
4 / 5
DIVIDE BY
8 / 16
CONTROL
LOGIC
D TYPE
Fig. 2 Block diagram
2100
MHz Very Low Current Multi-Modulus Divider
Ordering Information
Industrial Temperature Range
Miniature Plastic SOIC Package
SP8714/IG/MPAS
SP8714/IG/MPAC
SP8714/IG/MPB
Q
SP8714/IG/MPB
P
*Pb Free Matte Tin
8 Pin SOP/SOIC
8 Pin SOP/SOIC
8 Pin SOP/SOIC* Tape & Reel
8 Pin SOP/SOIC* Tubes
Tubes
Tape & Reel
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright
1999
-2006
, Zarlink Semiconductor Inc. All Rights Reserved.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SP8714MPBQ | 2100 MHz Very Low Current Multi-Modulus Divider |
| SP8782B | 1GHz 16/17, 32/33 Multi-Modulus Divider |
| SP8782DG | 1GHz 16/17, 32/33 Multi-Modulus Divider |
| SP8782MP | 1GHz 16/17, 32/33 Multi-Modulus Divider |
| SP8782MP2Q | 1GHz 16/17, 32/33 Multi-Modulus Divider |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SP8714MPBQ | 制造商:ZARLINK 制造商全稱:Zarlink Semiconductor Inc 功能描述:2100 MHz Very Low Current Multi-Modulus Divider |
| SP8715 | 制造商:ZARLINK 制造商全稱:Zarlink Semiconductor Inc 功能描述:1100MHz Very Low Current Multi-Modulus Divider |
| SP8715/IG/MPAC | 制造商:ZARLINK 制造商全稱:Zarlink Semiconductor Inc 功能描述:1100MHz Very Low Current Multi-Modulus Divider |
| SP8715/IG/MPAS | 制造商:ZARLINK 制造商全稱:Zarlink Semiconductor Inc 功能描述:1100MHz Very Low Current Multi-Modulus Divider |
| SP8715-1G-1CAC DIE | 制造商:Zarlink Semiconductor Inc 功能描述: |
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