
Advance Data Sheet
December 2000
T8301 Internet Protocol Telephone
Phone-On-A-Chip
IP Solution DSP
1 Introduction
Lucent Technologies’
Phone-On-A-Chip
IP Solution
is a highly integrated set of IC chips that form the
basic building blocks for an internet protocol tele-
phone (IPT), residing on a local area network (LAN).
The IPT presently consists of two ICs—the T8301
(IPT_DSP) and the T8302 (IPT_
ARM
*).
The T8301 provides the audio processing engine for
voice compression and decompression, speaker-
phone echo cancellation, digital-to-analog and ana-
log-to-digital converters, low-pass filters, and
amplifiers to drive standard business telephone
handsets and speakerphone hardware.
The general-purpose processor chip T8302 controls
system I/O (Ethernet, USB, IrDA, etc.) and provides
general telephone control features (LED control, key-
pad button scanning, LCD module interface, etc.).
A block diagram of the T8301 can be found in
Figure 3 on page 8.
Since the DSP1627 is an integral part of the T8301,
we will refer to the
DSP1627 Digital Signal Processor
Data Sheet throughout this discussion.
1.1 Features
I
DSP1627 core with bit manipulation unit.
I
DSP clock speeds up to 80 MHz.
I
Instruction ROM, 32K x 16 (zero wait-state
at 80 MHz).
*
ARM
is a registered trademark of Advanced RISC Machines Lim-
ited.
I
Dual-port RAM, 6K x 16 (zero wait-state at
80 MHz).
I
Internal SRAM, 16K x 16 (single wait-state at
80 MHz).
I
16-bit analog-to-digital converter.
I
Programmable gain amplifier on audio input.
I
Fixed gain differential microphone input.
I
Analog input SRAM buffer, 512 x 16.
I
Timed DMA for analog input SRAM.
I
Two 16-bit digital-to-analog converters.
I
Independent simultaneous speaker and handset
outputs.
I
Two integrated differential speaker driver outputs.
I
Two analog output SRAM buffers, 512 x 16 each.
I
Two timed DMA outputs for simultaneous handset
and speaker audio output.
I
Low-pass filtering on audio inputs and outputs.
I
Serial I/O interface.
I
General-purpose timer counter.
I
Bit I/O interface.
I
JTAG test and debugging control.
I
Implementation in 0.35
μ
m, 5 V silicon technology.
I
Packaged in 100-pin TQFP