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參數資料
| 型號： | TFP401PZPG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| 封裝： | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, HTQFP-100 |
| 文件頁數： | 16/20頁 |
| 文件大小： | 393K |
| 代理商： | TFP401PZPG4 |
TFP401, TFP401A
TI PanelBus DIGITAL RECEIVER
SLDS120B - MARCH 2000 REVISED JUNE 2003
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Terminal Functions (continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
I/O
DESCRIPTION
RxC+
93
AI
Clock positive receiver input – Positive side of reference clock. TMDS low voltage signal differential input pair
RxC
94
AI
Clock negative receiver input – Negative side of reference clock. TMDS low voltage signal differential input
pair.
Rx0+
90
AI
Channel-0 positive receiver input – Positive side of channel-0. TMDS low voltage signal differential input pair.
Channel-0 receives blue pixel data in active display and HSYNC, VSYNC control signals in blank.
Rx0
91
AI
Channel-0 negative receiver input – Negative side of channel-0. TMDS low voltage signal differential input
pair.
Rx1+
85
AI
Channel-1 positive receiver input – Positive side of channel-1 TMDS low voltage signal differential input pair.
Channel-1 receives green pixel data in active display and CTL1 control signals in blank.
Rx1
86
AI
Channel-1 negative receiver input – Negative side of channel-1 TMDS low voltage signal differential input pair
Rx2+
80
AI
Channel-2 positive receiver input – Positive side of channel-2 TMDS low voltage signal differential input pair.
Channel-2 receives red pixel data in active display and CTL2, CTL3 control signals in blank.
Rx2
81
AI
Channel-2 negative receiver input – Negative side of channel-2 TMDS low voltage signal differential input pair.
SCDT
8
DO
Sync detect – Output to signal when the link is active or inactive. The link is considered to be active when DE is
actively switching. The TFP401/401A monitors the state DE to determine link activity. SCDT can be tied
externally to PDO to power down the output drivers when the link is inactive.
High: Active link
Low: Inactive link
ST
3
DI
Output drive strength select – Selects output drive strength for high or low current drive. (See dc specifications
for IOH and IOL vs ST state.)
High : High drive strength
Low : Low drive strength
STAG
7
DI
Staggered pixel select – An active low signal used in the 2-pixel/clock pixel mode (PIXS = high). Time staggers
the even and odd pixel outputs to reduce ground bounce. Normal operation outputs the odd and even pixels
simultaneously.
High : Normal simultaneous even/odd pixel output
Low: Time staggered even/odd pixel output
VSYNC
47
DO
Vertical sync output
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, DVDD, AVDD, OVDD, PVDD
-0.3 V to 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, logic/analog signals
-0.3 V to 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating ambient temperature range
0
°C to 70°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range
- 65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 10 seconds
260
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
260
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package power dissipation/PowerPAD
: Soldered (see Note 1)
4.3 W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Not soldered (see Note 2)
2.7 W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Protection, all pins
2.5 KV Human Body Model
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JEDEC latchup (EIA/JESD78)
100 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. Specified with PowerPAD
bond pad on the backside of the package soldered to a 2 oz. Cu plate PCB thermal plane. Specified
at maximum allowed operating temperature, 70
°C.
2. PowerPAD
bond pad on the backside of the package is not soldered to a thermal plane. Specified at maximum allowed operating
temperature, 70
°C.
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