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參數(shù)資料
| 型號： | THS3122IDDAR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封裝： | GREEN, PLASTIC, SOP-8 |
| 文件頁數(shù)： | 10/34頁 |
| 文件大小： | 1276K |
| 代理商： | THS3122IDDAR |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁當前第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁
-
40
-
20
0
20
40
60
80
100
T
Free-AirTemperature( C)
-
A
°
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
P
MaximumP
owerDissipation(W)
D
Max
-
T =+125
J
C
°
q
=158
/W
JA
C
°
q
=95
/W
JA
C
°
q
=58.4
/W
JA
C
°
SLOS382D
– SEPTEMBER 2001 – REVISED FEBRUARY 2011
For systems where heat dissipation is more critical,
the THS3125 and THS3122 are also available in an
8-pin MSOP with PowerPAD package that offers
even
better
thermal
performance.
The
thermal
coefficient
for
the
PowerPAD
packages
are
substantially improved over the traditional SOIC.
Maximum power dissipation levels are depicted in
Figure 50 for the available packages. The data for the
PowerPAD packages assume a board layout that
follows the PowerPAD layout guidelines discussed
above and detailed in the PowerPAD application note
(literature
number
also
illustrates the effect of not soldering the PowerPAD to
a
PCB.
The
thermal
impedance
increases
substantially, which may cause serious heat and
performance issues. Always solder the PowerPAD to
Results shown are with no air flow and PCB size of 3 in
× 3 in
the PCB for optimum performance.
(76,2 mm
× 76,2 mm).
When determining whether or not the device satisfies
θJA = 58.4°C/W for 8-pin MSOP with PowerPAD (DGN
the maximum power dissipation requirement, it is
package)
important to not only consider quiescent power
θJA = 95°C/W for 8-pin SOIC High-K test PCB (D package)
dissipation, but also dynamic power dissipation. Often
θJA = 158°C/W for 8-pin MSOP with PowerPAD without solder
times, this type of dissipation is difficult to quantify
Figure 50. Maximum Power Dissipation vs
because the signal pattern is inconsistent, but an
Ambient Temperature
estimate of the RMS power dissipation can provide
visibility into a possible problem.
18
2001–2011, Texas Instruments Incorporated
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| THS3122IDDARG3 | 功能描述:高速運算放大器 Dual High Output Current 120-MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3122IDG4 | 功能描述:高速運算放大器 Dual High Output Current 120-MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3122IDR | 功能描述:高速運算放大器 Dual High Output Current 120-MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3122IDRG4 | 功能描述:高速運算放大器 Dual High Output Current 120-MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3125 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOW-NOISE, HIGH-SPEED, 450 mA CURRENT FEEDBACK AMPLIFIERS |
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