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參數資料
| 型號： | THS4022CDRG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封裝： | PLASTIC, MS-012AA, SOIC-8 |
| 文件頁數： | 6/28頁 |
| 文件大小： | 922K |
| 代理商： | THS4022CDRG4 |
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Circuit Layout Considerations
SLOS265C – SEPTEMBER 1999 – REVISED JULY 2007
To achieve the levels of high-frequency performance of the THS402x, follow proper printed-circuit board
high-frequency design techniques. A general set of guidelines is given as follows. In addition, a THS402x
evaluation board is available to use as a guide for layout or for evaluating the device performance.
Ground planes—It is highly recommended that a ground plane be used on the board to provide all
components with a low-inducance ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
Proper power-supply decoupling—Use a 6.8-μF tantalum capacitor in parallel with a 0.1-μF ceramic capacitor
on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the
application, but a 0.1-
μF ceramic capacitor should always be used on the supply terminal of every amplifier.
In addition, the 0.1-
μF capacitor should be placed as close as possible to the supply terminal. As this distance
increases, the inductance in the connecting trace makes the capacitor less effective. The designer should
strive for distances of less than 0.1 inch (2.54 mm) between the device power terminals and the ceramic
capacitors.
Sockets—Sockets are not recommended for high-speed operational amplifiers. The additional lead
inductance in the socket pins often produces stability problems. Surface-mount packages soldered directly to
the PCB is the best implementation.
Short trace runs/compact part placements—Optimum high-frequency performance is achieved when stray
series inductance has been minimized. To realize this, the circuit layout should be made as compact as
possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting
input of the amplifier. Its length should be kept as short as possible. This helps to minimize stray capacitance
at the input of the amplifier.
Surface-mount passive components—Using surface-mount passive components is recommended for
high-frequency amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout, thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept
as short as possible.
14
Copyright 1999–2007, Texas Instruments Incorporated
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相關代理商/技術參數 |
參數描述 |
|---|---|
| THS4022D | 制造商:TI 制造商全稱:Texas Instruments 功能描述:350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4022DGN | 制造商:TI 制造商全稱:Texas Instruments 功能描述:350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4022EVM | 功能描述:放大器 IC 開發工具 THS4022 Hi-Spd Amp Eval Mod RoHS:否 制造商:International Rectifier 產品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V |
| THS4022ID | 功能描述:高速運算放大器 Dual 350MHz RoHS:否 制造商:Texas Instruments 通道數量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4022IDG4 | 功能描述:高速運算放大器 Dual 350MHz RoHS:否 制造商:Texas Instruments 通道數量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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