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參數資料
| 型號： | THS4082IDG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封裝： | GREEN, PLASTIC, SOIC-8 |
| 文件頁數： | 10/32頁 |
| 文件大小： | 841K |
| 代理商： | THS4082IDG4 |
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THS4081, THS4082
175MHz LOW POWER HIGHSPEED AMPLIFIERS
SLOS274D DECEMBER 1999 REVISED JUNE 2001
18
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD
design considerations (continued)
The actual thermal performance achieved with the THS408xDGN in its PowerPAD
package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches
× 3 inches,
then the expected thermal coefficient,
θJA, is about 58.4_C/W. For comparison, the non-PowerPAD version
of the THS408x IC (SOIC) is shown. For a given
θJA, the maximum power dissipation is shown in Figure 46 and
is calculated by the following formula:
P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of THS408x IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA
= Free-ambient air temperature (
°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)
DGN Package
θJA = 58.4°C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θJA = 158°C/W
2 oz. Trace And
Copper Pad
Without Solder
SOIC Package
High-K Test PCB
θJA = 98°C/W
TJ = 150°C
SOIC Package
Low-K Test PCB
θJA = 167°C/W
2
1.5
1
0
40
20
0
20
40
Maximum
Power
Dissipation
W
2.5
3
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
60
80
100
0.5
TA Free-Air Temperature °C
NOTE A: Results are with no air flow and PCB size = 3”
× 3”
Figure 46. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package. This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| THS4082IDGN | 功能描述:高速運算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4082IDGNG4 | 功能描述:高速運算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4082IDGNR | 功能描述:高速運算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4082IDGNRG4 | 功能描述:高速運算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4082IDGNRMULT1 | 制造商:Texas Instruments 功能描述: |
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