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參數資料
| 型號： | THS4271DRBT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封裝： | EXPOSED PAD, LEADLESS, PLASTIC, MSOP-8 |
| 文件頁數： | 22/48頁 |
| 文件大小： | 1227K |
| 代理商： | THS4271DRBT |
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Single or Dual
68 Mils x 70 Mils
(Via diameter = 13mils)
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
www.ti.com
SLOS397F – JULY 2002 – REVISED OCTOBER 2009
5. Socketing a high speed part like the THS4271
PowerPAD PCB LAYOUT CONSIDERATIONS
is not recommended. The additional lead length
1. Prepare the PCB with a top side etch pattern as
and pin-to-pin capacitance introduced by the
shown in Figure 90. There should be etch for the
socket
can
create
a
troublesome
parasitic
leads as well as etch for the thermal pad.
network which can make it almost impossible to
achieve a smooth, stable frequency response.
Best results are obtained by soldering the
THS4271 onto the board.
PowerPAD DESIGN CONSIDERATIONS
The THS4271 and THS4275 are available in a
thermally-enhanced PowerPAD family of packages.
These packages are constructed using a downset
Figure 90. PowerPAD PCB Etch
leadframe upon which the die is mounted [see
and Via Pattern
Figure 89(a) and Figure 89(b)]. This arrangement
results in the lead frame being exposed as a thermal
2. Place five holes in the area of the thermal pad.
pad
on
the
underside
of
the
package
[see
The holes should be 13 mils in diameter. Keep
Figure 89(c)]. Because this thermal pad has direct
them small so that solder wicking through the
thermal contact with the die, excellent thermal
holes is not a problem during reflow.
performance can be achieved by providing a good
3. Additional vias may be placed anywhere along
thermal path away from the thermal pad.
the thermal plane outside of the thermal pad
area. They help dissipate the heat generated by
The PowerPAD package allows both assembly and
the THS4271 and THS4275 IC. These additional
thermal management in one manufacturing operation.
vias may be larger than the 13-mil diameter vias
During the surface-mount solder operation (when the
directly under the thermal pad. They can be
leads are being soldered), the thermal pad can also
larger because they are not in the thermal pad
be soldered to a copper area underneath the
area to be soldered, so that wicking is not a
package. Through the use of thermal paths within this
problem.
copper area, heat can be conducted away from the
4. Connect all holes to the internal ground plane.
package into either a ground plane or other heat
5. When connecting these holes to the ground
dissipating device.
plane, do not use the typical web or spoke via
The PowerPAD package represents a breakthrough
connection methodology. Web connections have
in combining the small area and ease of assembly of
a high thermal resistance connection that is
surface
mount
with
the
heretofore
awkward
useful for slowing the heat transfer during
mechanical methods of heatsinking.
soldering operations. This resistance makes the
soldering of vias that have plane connections
easier. In this application, however, low thermal
resistance is desired for the most efficient heat
transfer. Therefore, the holes under the THS4271
and THS4275 PowerPAD package should make
their connection to the internal ground plane, with
a
complete
connection
around
the
entire
circumference of the plated-through hole.
6. The top-side solder mask should leave the
Figure 89. Views of Thermally
terminals of the package and the thermal pad
Enhanced Package
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal pad area. This prevents solder from
Although there are many ways to properly heatsink
being pulled away from the thermal pad area
the PowerPAD package, the following steps illustrate
during the reflow process.
the recommended approach.
7. Apply solder paste to the exposed thermal pad
space
area and all of the IC terminals.
space
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
space
solder
reflow
operation
as
any
standard
space
surface-mount component. This results in a part
that is properly installed.
Copyright 2002–2009, Texas Instruments Incorporated
29
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相關代理商/技術參數 |
參數描述 |
|---|---|
| THS4271DRBTG4 | 功能描述:高速運算放大器 Super-Fast Ultra-Low Distortion RoHS:否 制造商:Texas Instruments 通道數量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4271DRG4 | 功能描述:高速運算放大器 Super-Fast Ultra-Low Distortion RoHS:否 制造商:Texas Instruments 通道數量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4271-EP | 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOW NOISE, HIGH SLEW RATE, UNITY GAIN STABLE VOLTAGE FEEDBACK AMPLIFIER |
| THS4271EVM | 功能描述:放大器 IC 開發工具 THS4271 Eval Mod RoHS:否 制造商:International Rectifier 產品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V |
| THS4271EVM-UG | 功能描述:放大器 IC 開發工具 THS4271 Eval Module w/ Unity Gain RoHS:否 制造商:International Rectifier 產品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V |
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