- 您現在的位置：買賣IC網 > PDF目錄98229 > THS7319IZSVR (TEXAS INSTRUMENTS INC) 3 CHANNEL, VIDEO AMPLIFIER, PBGA9 PDF資料下載
參數資料
| 型號： | THS7319IZSVR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 3 CHANNEL, VIDEO AMPLIFIER, PBGA9 |
| 封裝： | 1.50 X 1.50 MM, 0.35 MM HEIGHT, GREEN, UCSP-9 |
| 文件頁數： | 17/33頁 |
| 文件大小： | 733K |
| 代理商： | THS7319IZSVR |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁當前第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁
MinSpace S
T TraceWidth
MetalDiameter
SeeDimension
or
A
C
X Pitch
Y Pitch
SBOS468A – JUNE 2009 – REVISED JULY 2009.............................................................................................................................................................. www.ti.com
(1) Circuit traces from the NSMD-defined PWB lands should be 75-
m to 100-m wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand-off and impact reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is greater than the operating temperature range
of the intended application.
(3) For a PWB using a Ni/Au surface-finish, the Au thickness should be less than 0.5
m to avoid a reduction in thermal fatigue performance.
(4) Solder mask thickness should be less than 20
m above the copper circuit pattern.
(5) Best solder stencil performance is achieved using laser-cut stencils with electro-polishing. Use of chemically-etched stencils results in
inferior solder-paste volume control.
(6) Trace routing away from the MicrostarCSP device should be balanced in X and Y directions to avoid unintentional component movement
because of solder wetting forces.
Figure 54. Trace Width/Spacing Example
Table 3. Definitions for Figure 54
(S or T) TRACE
PAD
PACKAGE PITCH
(A or C) METAL DIAMETER
WIDTH/SPACING
NSMD
0.50 mm
0.25 mm
0.08 mm
24
Copyright 2009, Texas Instruments Incorporated
Product Folder Link(s): THS7319
相關PDF資料 |
PDF描述 |
|---|---|
| THS7319IZSVT | 3 CHANNEL, VIDEO AMPLIFIER, PBGA9 |
| THS7360IPWR | VIDEO AMPLIFIER, PDSO20 |
| THS7360IPW | VIDEO AMPLIFIER, PDSO20 |
| THS7364IPWR | 6 CHANNEL, VIDEO AMPLIFIER, PDSO20 |
| THS7364IPW | 6 CHANNEL, VIDEO AMPLIFIER, PDSO20 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| THS7319IZSVT | 功能描述:視頻放大器 3Ch Very Lo Pwr Lo Prof EDTV Video Amp RoHS:否 制造商:ON Semiconductor 通道數量:4 電源類型: 工作電源電壓:3.3 V, 5 V 電源電流: 最小工作溫度: 最大工作溫度: 封裝 / 箱體:TSSOP-14 封裝:Reel |
| THS7320 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:3-Channel ED Filter Video Amplifier with 4-V/V Gain |
| THS7320IYHCR | 制造商:Texas Instruments 功能描述:3-CHANL ED FILTER VIDEO AMP, 4V/V GAIN - Tape and Reel 制造商:Texas Instruments 功能描述:IC 3-CH INTEG VIDEO AMP 9DSBGA 制造商:Texas Instruments 功能描述:Video Amplifiers 3-Ch ED Fltr Video Amp w/ 4V/V Gain 制造商:Texas Instruments 功能描述:3-Chanl ED Filter Video Amp, 4V/V Gain |
| THS7320IYHCT | 制造商:Texas Instruments 功能描述:IC 3-CH INTEG VIDEO AMP 9DSBGA |
| THS7320YHCEVM | 制造商:Texas Instruments 功能描述:THS7320YHCEVM - Boxed Product (Development Kits) 制造商:Texas Instruments 功能描述:Texas Instruments THS7320YHCEVM Development Kits 制造商:Texas Instruments 功能描述:MODULE EVAL FOR THS7320 ZSV 制造商:Texas Instruments 功能描述:EVAL BOARD, THS7320 VIDEO AMPLIFIER, Silicon Manufacturer:Texas Instruments, Silicon Core Number:THS7320, Kit Application Type:Amplifier, Application Sub Type:Video Buffer and Filter, Kit Contents:Eval Board THS7320 |
發布緊急采購，3分鐘左右您將得到回復。