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參數(shù)資料
| 型號： | THS7319IZSVT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 3 CHANNEL, VIDEO AMPLIFIER, PBGA9 |
| 封裝： | 1.50 X 1.50 MM, 0.35 MM HEIGHT, GREEN, UCSP-9 |
| 文件頁數(shù)： | 16/33頁 |
| 文件大?。?/td> | 733K |
| 代理商： | THS7319IZSVT |
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PRINTED WIRING BOARD (PWB) DESIGN GUIDE
CopperTrace
Width
SolderMaskThickness
SolderPadWidth
SolderMaskOpening
CopperTraceThickness
www.ti.com.............................................................................................................................................................. SBOS468A – JUNE 2009 – REVISED JULY 2009
the solder mask opening is made larger than the
When designing the pad size for the MicrostarCSP, it
desired land area, and the opening size is defined by
is recommended that the layout use a non-solder
mask defined (NSMD) landing pad. With this method,
the land pattern recommendations. Figure 54 and
Table 3 show a trace width example.
Figure 53. Land Pattern Recommendations
Table 2. Definitions for Figure 53
SOLDER MASK
SOLDER PAD
COPPER PAD
OPENING
STENCIL OPENING
STENCIL THICKNESS
Non-solder mask defined
250
m × 250 m square
200
m to 275 m
Copper pad + 50
m
100
m
(NSMD)
(rounded corners)
Copyright 2009, Texas Instruments Incorporated
23
Product Folder Link(s): THS7319
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