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參數(shù)資料
| 型號(hào)： | TLC7524IFNRG3 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | DAC |
| 英文描述： | PARALLEL, 8 BITS INPUT LOADING, 0.1 us SETTLING TIME, 8-BIT DAC, PQCC20 |
| 封裝： | GREEN, PLASTIC, LCC-20 |
| 文件頁數(shù)： | 4/21頁 |
| 文件大小： | 634K |
| 代理商： | TLC7524IFNRG3 |
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLC7524IDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7524IDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7524IDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7524IFN
ACTIVE
PLCC
FN
20
46
Green (RoHS &
no Sb/Br)
CU SN
Level-1-260C-UNLIM
TLC7524IFNG3
ACTIVE
PLCC
FN
20
46
Green (RoHS &
no Sb/Br)
CU SN
Level-1-260C-UNLIM
TLC7524IFNR
ACTIVE
PLCC
FN
20
1000 Green (RoHS &
no Sb/Br)
CU SN
Level-1-260C-UNLIM
TLC7524IFNRG3
ACTIVE
PLCC
FN
20
1000 Green (RoHS &
no Sb/Br)
CU SN
Level-1-260C-UNLIM
TLC7524IN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC7524INE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC7524IPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7524IPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7524IPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC7524IPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
5-Oct-2007
Addendum-Page 2
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| TLC7524CPWLE | PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, PDSO16 |
| TLC7528CN | PARALLEL, 8 BITS INPUT LOADING, 0.1 us SETTLING TIME, 8-BIT DAC, PDIP20 |
| TLC7528CDWR | PARALLEL, 8 BITS INPUT LOADING, 0.1 us SETTLING TIME, 8-BIT DAC, PDSO20 |
| TLC7528EDW | PARALLEL, 8 BITS INPUT LOADING, 0.1 us SETTLING TIME, 8-BIT DAC, PDSO20 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLC7524IN | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8bit MULTIPLYING DA RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLC7524INE4 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8-Bit 0.1 us MDAC Parallel Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLC7524IPW | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8-Bit 0.1 us MDAC Parallel Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLC7524IPWG4 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8-Bit 0.1 us MDAC Parallel Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLC7524IPWR | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8-Bit 0.1 us MDAC Parallel Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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