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參數資料
| 型號： | TLGE33TPF |
| 廠商： | Toshiba Corporation |
| 英文描述： | Panel Circuit Indicators |
| 中文描述： | 面板電路指標 |
| 文件頁數： | 1/3頁 |
| 文件大小： | 250K |
| 代理商： | TLGE33TPF |
TLGE33TP(F)
2007-10-01
1
TOSHIBA InGaA
P LED
TLGE33TP(F)
Panel Circuit Indicators
Lead(Pb)-free products (lead: Sn-Ag-Cu)
2.5x5mm package
InGaA
P technology
Transparent lens
Excellent low current light output
High intensity light emission
Excellent low current light output
Applications: dashboard displays, various indicator
Stopper lead type is also available
Lineup
Product Name
Color
Material
TLGE33TP(F)
green
P
InGaA
l
Absolute Maximum Ratings
(Ta
=
25°C)
Product Name
Forward Current
I
F
(mA)
Reverse Voltage
V
R
(V)
Power Dissipation
P
D
(mW)
Operating
Temperature
T
opr
(°C)
Storage
Temperature
T
stg
(°C)
TLGE33TP(F)
50
4
120
40~100
40~120
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics
(Ta
=
25°C)
Typ. Emission Wavelength
(Note)
Luminous Intensity
I
V
(
Note)
Forward Voltage
V
F
Reverse Current
I
R
Product Name
λ
d
λ
P
Δλ
I
F
Min
Typ.
I
F
Typ.
Max
I
F
Max
V
R
TLGE33TP(F)
571
(574)
17
20
476
1300
20
2.0
2.4
20
50
4
Unit
nm
mA
mcd
mA
V
mA
μ
A
V
Note:Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes single
Luminous Intensity class. I
V
R: 476-1290mcd, S: 850-2300mcd,T: 530mcd -
λ
d
1: 565-573nm, 2: 569-576nm
Precautions
Please be careful of the following:
Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.
Unit: mm
JEDEC
JEITA
TOSHIBA
4-5AG2
Weight: 0.23 g (Typ.)
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