- 您現在的位置：買賣IC網 > PDF目錄98257 > TLV5614IDG4 (TEXAS INSTRUMENTS INC) SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO16 PDF資料下載
參數資料
| 型號： | TLV5614IDG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | DAC |
| 英文描述： | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO16 |
| 封裝： | GREEN, PLASTIC, MS-012AC, SOIC-16 |
| 文件頁數： | 6/34頁 |
| 文件大小： | 737K |
| 代理商： | TLV5614IDG4 |
第1頁第2頁第3頁第4頁第5頁當前第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁
TLV5614
2.7-V TO 5.5-V 12-BIT 3-
S QUADRUPLE DIGITAL-TO-ANALOG CONVERTERS
WITH POWER DOWN
SLAS188B – SEPTEMBER 1998 – REVISED APRIL 2003
14
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
In power-down mode, all amplifiers within the TLV5614 are disabled. A particular DAC (A, B, C, D) of the
TLV5614 is selected by A1 and A0 within the input word.
A1
A0
DAC
0
A
0
1
B
1
0
C
1
D
Using TLV5614IYE, Bumped Dice
D Melting point of eutectic solder is 183°C.
D Recommended peak reflow temperatures are in the 220°C to 230°C range.
D The use of underfill is required. The use of underfill greatly reduces the risk of thermal mismatch fails.
Underfill is an epoxy/adhesive that may be added during the board assembly process to improve board
level/system level reliability. The process is to dispense the epoxy under the dice after die attach reflow. The
epoxy adheres to the body of the device and to the printed-circuit board. It reduces stress placed upon the solder
joints due to the thermal coefficient of expansion (TCE) mismatch between the board and the component.
Underfill material is highly filled with silica or other fillers to increase an epoxy’s modulus, reduce creep
sensitivity, and decrease the material’s TCE.
The recommendation for peak flow temperatures of 220
°C to 230°C is based on general empirical results that
indicate that this temperature range is needed to facilitate good wetting of the solder bump to the substrate or
circuit board pad. Lower peak temperatures may cause nonwets (cold solder joints).
NOTE A: All linear dimensions are in millimeters.
NOTE B: This drawing is subject to change without notice.
NOTE C: Scale = 18x
Figure 17. TLV5614IYE Bumped Dice
相關PDF資料 |
PDF描述 |
|---|---|
| TLV5614ID | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO16 |
| TLV5614CPWR | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO16 |
| TLV5614CD | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO16 |
| TLV5614IPWR | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO16 |
| TLV5614CDG4 | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO16 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TLV5614IDR | 功能描述:數模轉換器- DAC 12-Bit 3 us Quad DAC Serial Input RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614IDRG4 | 功能描述:數模轉換器- DAC 12-Bit 3 us Quad DAC Serial Input RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614IPW | 功能描述:數模轉換器- DAC 10bit Quad Serial RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614IPWG4 | 功能描述:數模轉換器- DAC 12-Bit 3 us Quad DAC Serial Input RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614IPWR | 功能描述:數模轉換器- DAC 12-Bit 3 us Quad DAC Serial Input RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
發布緊急采購，3分鐘左右您將得到回復。