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參數(shù)資料
| 型號(hào)： | TLV5614IDRG4 |
| 廠(chǎng)商： | TEXAS INSTRUMENTS INC |
| 元件分類(lèi)： | DAC |
| 英文描述： | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO16 |
| 封裝： | GREEN, PLASTIC, MS-012AC, SOIC-16 |
| 文件頁(yè)數(shù)： | 6/34頁(yè) |
| 文件大小： | 737K |
| 代理商： | TLV5614IDRG4 |
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TLV5614
2.7-V TO 5.5-V 12-BIT 3-
S QUADRUPLE DIGITAL-TO-ANALOG CONVERTERS
WITH POWER DOWN
SLAS188B – SEPTEMBER 1998 – REVISED APRIL 2003
14
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
In power-down mode, all amplifiers within the TLV5614 are disabled. A particular DAC (A, B, C, D) of the
TLV5614 is selected by A1 and A0 within the input word.
A1
A0
DAC
0
A
0
1
B
1
0
C
1
D
Using TLV5614IYE, Bumped Dice
D Melting point of eutectic solder is 183°C.
D Recommended peak reflow temperatures are in the 220°C to 230°C range.
D The use of underfill is required. The use of underfill greatly reduces the risk of thermal mismatch fails.
Underfill is an epoxy/adhesive that may be added during the board assembly process to improve board
level/system level reliability. The process is to dispense the epoxy under the dice after die attach reflow. The
epoxy adheres to the body of the device and to the printed-circuit board. It reduces stress placed upon the solder
joints due to the thermal coefficient of expansion (TCE) mismatch between the board and the component.
Underfill material is highly filled with silica or other fillers to increase an epoxy’s modulus, reduce creep
sensitivity, and decrease the material’s TCE.
The recommendation for peak flow temperatures of 220
°C to 230°C is based on general empirical results that
indicate that this temperature range is needed to facilitate good wetting of the solder bump to the substrate or
circuit board pad. Lower peak temperatures may cause nonwets (cold solder joints).
NOTE A: All linear dimensions are in millimeters.
NOTE B: This drawing is subject to change without notice.
NOTE C: Scale = 18x
Figure 17. TLV5614IYE Bumped Dice
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV5614IPW | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 10bit Quad Serial RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614IPWG4 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12-Bit 3 us Quad DAC Serial Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614IPWR | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12-Bit 3 us Quad DAC Serial Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614IPWRG4 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12-Bit 3 us Quad DAC Serial Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614IYE | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 2.7-5.5V 12-Bit RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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