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參數(shù)資料
| 型號： | TLV5624IDGK |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | DAC |
| 英文描述： | SERIAL INPUT LOADING, 3.5 us SETTLING TIME, 8-BIT DAC, PDSO8 |
| 封裝： | GREEN, PLASTIC, MSOP-8 |
| 文件頁數(shù)： | 7/22頁 |
| 文件大小： | 571K |
| 代理商： | TLV5624IDGK |
PACKAGE OPTION ADDENDUM
www.ti.com
19-Jan-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TLV5624CD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5624CDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5624CDGK
ACTIVE
MSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-1-260C-UNLIM
TLV5624CDGKG4
ACTIVE
MSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-1-260C-UNLIM
TLV5624CDGKR
ACTIVE
MSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-1-260C-UNLIM
TLV5624CDGKRG4
ACTIVE
MSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-1-260C-UNLIM
TLV5624ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5624IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5624IDGK
ACTIVE
MSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-1-260C-UNLIM
TLV5624IDGKG4
ACTIVE
MSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-1-260C-UNLIM
TLV5624IDGKR
ACTIVE
MSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-1-260C-UNLIM
TLV5624IDGKRG4
ACTIVE
MSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-1-260C-UNLIM
TLV5624IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV5624IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV5624IDGKG4 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8-Bit 1.0-3.5us DAC Serial Out RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5624IDGKR | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8-Bit 1.0-3.5us DAC Serial Out RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5624IDGKRG4 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8-Bit 1.0-3.5us DAC Serial Out RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5624IDR | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8-Bit 1.0-3.5us DAC Serial Out RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5624IDRG4 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 8-Bit 1.0-3.5us DAC Serial Out RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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