
TLV821 SINGLE/TLV822 DUAL/TLV824 QUAD
OPERATIONAL AMPLIFIERS
SLOS296A – FEBRUARY 2000 – REVISED MAY 2000
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
2.7-V and 5-V Performance
No Crossover Distortion
Low Supply Current at V
CC+
= 5 V:
TLV821 . . . 0.3 mA Typ
TLV822 . . . 0.5 mA Typ
TLV824 . . . 1 mA Typ
Rail-to-Rail Output Swing
Pin-to-Pin Compatible with LMV821,
LMV822, and LMV824 Devices
Package Options Include Plastic
Small-Outline (D), Small-Outline Transistor
(SOT-23 DBV, SC-70 DCK), and Thin Shrink
Small-Outline (PW) Packages
description
The TLV821, TLV822, and TLV824 devices are
low-voltage (2.5 V to 5.5 V) low-power operational
amplifiers, designed to be functionally and
pin-to-pin compatible with the LMV821, LMV822,
and LMV824 devices. Electrical characteristics
are very similar to the LMV3xx operational
amplifiers (low supply current, rail-to-rail outputs,
input common-mode range, which includes
ground). The TLV8xx devices have a significantly
higher bandwidth (8 MHz typically) and a 2.5-V/ s
slew rate. The TLV821 is a single, the TLV822 is
a dual, and the TLV824 is a quad operational
amplifier.
These devices are the most cost-effective solution for applications requiring low-voltage/low-power operation
and space-saving considerations. The TLV821 is available in the ultra-small DCK package, which is
approximately half the size of the DBV package. The DCK package saves space on PC boards and enables
the design of small portable electronic devices (cordless and cellular phones, laptops, PDAs, PCMIAs). It also
allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal
integrity.
The TLV821I, TLV822I, and TLV824I devices are characterized for operation from –40
°
C to 85
°
C.
symbol (each amplifier)
OUT
IN–
IN+
_
+
P
Copyright
2000, Texas Instruments Incorporated
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN–
1IN+
V
CC+
2IN+
2IN–
2OUT
4OUT
4IN–
4IN+
GND
3IN+
3IN–
3OUT
TLV824 . . . D OR PW PACKAGE
(TOP VIEW)
TLV822 . . . D OR PW PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1OUT
1IN –
1IN+
GND
V
CC+
2OUT
2IN –
2IN+
TLV821 . . . DBV OR DCK PACKAGE
(TOP VIEW)
V
CC+
1
2
3
5
4
IN+
GND
IN–
OUT
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.