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參數資料
型號: TMC1175AB2F20
廠商: FAIRCHILD SEMICONDUCTOR CORP
元件分類: ADC
英文描述: 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP24
封裝: CERAMIC, DIP-24
文件頁數: 5/20頁
文件大小: 427K
代理商: TMC1175AB2F20
PRODUCT SPECIFICATION
TMC1175A
REV. 1.3.3 2/28/02
13
Figure 12. Typical Interface Circuit-High Performance
+5V
+
-
+
-
0.1
F
2V
0.1mF
0.1
F
VDDA
VDDD
VR+
RT
RB
VR-
VIN
AGND
DGND
OE
CONV
D7-0
TMC1175A
0.1
F
0.1
F
2k
1k
LM385
1k
1k
75
455
455
20
Video
Input
+5V
Regulated +5V
Gain Adjust
+5V
27056A
Wideband
Op-amp
Figure 13. Typical Interface Circuit – Low Cost
Figure 14. Typical Interface Circuit – Stabilized Reference
0.1
F
0.1
F
0.1
F
10
F
+5V
2.2k
2k
560
75
Video
Input
24458A
Offset
Adjust
+5V
0.1
F
0.1
F
VDDA
VDDD
VR+
RT
RB
VR-
VIN
AGND
DGND
OE
CONV
D7-0
TMC1175A
0.1
F
10
F
1k
1k
56
RF
Input
24457A
+5V
0.1
F
0.1
F
VDDA
VDDD
VR+
RT
RB
VR-
VIN
AGND
DGND
OE
CONV
D7-0
TMC1175A
LM385
Grounding
The TMC1175A has separate analog and digital
circuits. To keep digital system noise from the A/D
converter, it is recommended that power supply voltages
(VDDD and VDDA) originate from separate sources with
VDDA regulated, and that ground connections (DGND and
AGND) be made to the analog ground plane. Power supply
pins should be individually decoupled at the pin. The digital
circuitry that gets its input from the TMC1175A should be
referred to the system digital ground plane.
Printed Circuit Board Layout
Designing with high performance mixed-signal circuits
demands printed circuits with ground planes. Wire-wrap is
not an option, even for breadboarding. Overall system per-
formance is strongly inuenced by the board layout. Capac-
itive coupling from digital to analog circuits may result in
poor A/D conversion. Consider the following suggestions
when doing the layout:
1.
Keep the critical analog traces (VIN, RT, RB, VR+,
VR-) as short as possible and as far as possible from all
digital signals. The TMC1175A should be located near
the board edge, close to the analog input connectors.
2.
The power plane for the TMC1175A should be sepa-
rate from that which supplies the rest of the digital cir-
cuitry. A single power plane should be used for all of
the VDD pins. If the power supply for the TMC1175A
is the same as that of the system's digital circuitry,
power to the TMC1175A should be decoupled with
ferrite beads and 0.1F capacitors to reduce noise.
3.
The ground plane should be solid, not cross-hatched.
Connections to the ground plane should have very
short leads.
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相關代理商/技術參數
參數描述
TMC1175AC3F20 制造商:Rochester Electronics LLC 功能描述:- Bulk
TMC1175AM7C20 功能描述:視頻模擬/數字化轉換器集成電路 Mixed Signal FG RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉換器數量:1 ADC 輸入端數量:4 轉換速率:3 Gbps 分辨率:8 bit 結構: 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TMC1175AM7C20_Q 功能描述:視頻模擬/數字化轉換器集成電路 Mixed Signal FG RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉換器數量:1 ADC 輸入端數量:4 轉換速率:3 Gbps 分辨率:8 bit 結構: 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TMC1175AM7C20T 功能描述:視頻模擬/數字化轉換器集成電路 8Bit Video Converter 20MSPS a/D RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉換器數量:1 ADC 輸入端數量:4 轉換速率:3 Gbps 分辨率:8 bit 結構: 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TMC1175AM7C30 功能描述:視頻模擬/數字化轉換器集成電路 8Bit Video Converter 3MSPS a/D RoHS:否 制造商:Texas Instruments 輸入信號類型:Differential 轉換器數量:1 ADC 輸入端數量:4 轉換速率:3 Gbps 分辨率:8 bit 結構: 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
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