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參數(shù)資料
| 型號(hào)： | TPA0222PWP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類(lèi)： | 音頻控制 |
| 英文描述： | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
| 封裝： | GREEN, PLASTIC, HTSSOP-24 |
| 文件頁(yè)數(shù)： | 9/37頁(yè) |
| 文件大小： | 866K |
| 代理商： | TPA0222PWP |
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THERMAL INFORMATION
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
TPA0222
SLOS285B – NOVEMBER 1999 – REVISED NOVEMBER 2004
The thermally enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see
Figure 41) to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down
TO-220-type packages have leads formed as gull wings to make them applicable for surface-mount applications.
These packages have only two shortcomings: they do not address the low-profile requirements (< 2 mm) of
many of today's advanced systems, and they do not offer a terminal-count high enough to accommodate
increasing
integration.
On
the
other
hand,
traditional
low-power
surface-mount
packages
require
power-dissipation derating that severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with
thermal performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths
that remove heat from the component. The thermal pad is formed using a patented lead-frame design and
manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or
otherwise thermally coupled to an external heat dissipator, high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved.
Figure 41. Views of Thermally Enhanced PWP Package
17
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPA0222PWPG4 | 功能描述:音頻放大器 St 2W Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA0222PWPR | 功能描述:音頻放大器 St 2W Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA0222PWPRG4 | 功能描述:音頻放大器 St 2W Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA0223 | 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE |
| TPA0223DGQ | 功能描述:音頻放大器 2W Mono Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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