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參數(shù)資料
| 型號： | TPA0312PWPRG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻控制 |
| 英文描述： | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
| 封裝： | GREEN, PLASTIC, HTSSOP-24 |
| 文件頁數(shù)： | 23/36頁 |
| 文件大小： | 791K |
| 代理商： | TPA0312PWPRG4 |
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TPA0312
SLOS335A – DECEMBER 2000 – REVISED OCTOBER 2004
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
BYPASS
11
Tap to voltage divider for internal mid-supply bias generator
GAIN0
2
I
Bit 0 of gain control
GAIN1
3
I
Bit 1 of gain control
1, 12, 13,
GND
Ground connection for circuitry. Connected to the thermal pad.
24
LHPIN
6
I
Left-channel headphone input, selected when SE/BTL is held high
LIN
10
I
Common left input for fully differential input. AC ground for single-ended inputs.
LLINEIN
5
I
Left-channel line input, selected when SE/BTL is held low
LOUT+
4
O
Left-channel positive output in BTL mode and positive output in SE mode
LOUT-
9
O
Left-channel negative output in BTL mode and high-impedance in SE mode
The input for PC Beep mode. PC-BEEP is enabled when a > 1.5-V (peak-to-peak) square wave is input
PC-BEEP
14
I
to PC-BEEP
HP/LINE is the input MUX control input. When the HP/LINE terminal is held high, the headphone inputs
HP/LINE
17
I
(LHPIN or RHPIN [6, 20]) are active. When the HP/LINE terminal is held low, the line inputs (LLINEIN or
RLINEIN [5, 23]) are active.
PVDD
7, 18
I
Power supply for output stage
RHPIN
20
I
Right-channel headphone input, selected when SE/BTL is held high
RIN
8
I
Common right input for fully differential input. AC ground for single-ended inputs.
RLINEIN
23
I
Right-channel line input, selected when SE/BTL is held low
ROUT+
21
O
Right-channel positive output in BTL mode and positive output in SE mode
ROUT-
16
O
Right-channel negative output in BTL mode and high-impedance in SE mode
SHUTDOWN
22
I
Places entire IC in shutdown mode when held low, except PC-BEEP remains active
SE/BTL
15
I
Hold SE/BTL low for BTL mode and hold high for SE mode.
VDD
19
I
Analog VDD input supply. This terminal needs to be isolated from PVDD to achieve highest performance.
Connect to ground. Must be soldered down in all applications to properly secure the device on the PC
Thermal Pad
board.
3
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