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參數資料
| 型號： | TPA032D04DCARG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 10 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO48 |
| 封裝： | PLASTIC, HTSSOP-48 |
| 文件頁數： | 15/26頁 |
| 文件大小： | 439K |
| 代理商： | TPA032D04DCARG4 |
TPA032D04
10W STEREO CLASSD AUDIO POWER AMPLIFIER
SLOS203B DECEMBER 1999 REVISED JUNE 2000
23
TI.COM
THERMAL INFORMATION
The thermally enhanced DCA package is based on the 56-pin TSSOP, but includes a thermal pad (see Figure 13)
to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface-mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have only two shortcomings: they do not address the very low profile requirements (< 2 mm) of many of
today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that
severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing
technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally
coupled to an external heat dissipator, high power dissipation in the ultrathin, fine-pitch, surface-mount package can
be reliably achieved.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
Figure 13. Views of Thermally Enhanced DCA Package
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