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參數資料
| 型號： | TPA2010D1YZF |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2.5 W, 1 CHANNEL, AUDIO AMPLIFIER, BGA9 |
| 封裝： | LEAD FREE, NANOFREE, WCSP-9 |
| 文件頁數： | 6/25頁 |
| 文件大小： | 783K |
| 代理商： | TPA2010D1YZF |
www.ti.com
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+
IN-
IN+
PWM
H-
Bridge
VO+
VO-
Internal
Oscillator
CS
To Battery
VDD
GND
Bias
Circuitry
RI2
RP
Filter-Free Class D
SHUTDOWN
RI1
Single-Ended
Input 2
CI2
CP
Single-Ended
Input 1
CI1
BOARD LAYOUT
Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
SLOS417C – OCTOBER 2003 – REVISED SEPTEMBER 2007
Figure 32. Application Schematic With TPA2010D1 Summing Two Single-Ended Inputs
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 33 and Table 2 show the appropriate diameters for a
WCSP layout. The TPA2010D1 evaluation module (EVM) layout is shown in the next section as a layout
example.
Figure 33. Land Pattern Dimensions
14
Copyright 2003–2007, Texas Instruments Incorporated
Product Folder Link(s): TPA2010D1
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相關代理商/技術參數 |
參數描述 |
|---|---|
| TPA2010D1YZFR | 功能描述:音頻放大器 Mono Filter-Free Class-D in WCSP RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA2010D1YZFRG4 | 制造商:TI 功能描述:AUDIO POWER AMPLIFIER |
| TPA2010D1YZFT | 功能描述:音頻放大器 Mono Filter-Free Class-D in WCSP RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA2011D1 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:3.2W Mono Filter-Free Class-D Audio Power Amplifier With Auto-Recovering Short-Circuit Protection |
| TPA2011D1_12 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:3.2W Mono Filter-Free Class-D Audio Power Amplifier |
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