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參數資料
| 型號： | TPA2016D2YZHT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2.8 W, 2 CHANNEL, AUDIO AMPLIFIER, BGA16 |
| 封裝： | 2.20 X 2.20 MM, GREEN, DSBGA-16 |
| 文件頁數： | 21/38頁 |
| 文件大小： | 1216K |
| 代理商： | TPA2016D2YZHT |
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COMPONENT LOCATION
TRACE WIDTH
SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
Figure 41. Land Pattern Dimensions
Table 5. Land Pattern Dimensions(1) (2) (3) (4)
SOLDER PAD
SOLDER MASK(5)
COPPER
STENCIL
COPPER PAD
STENCIL(6) (7) OPENING
DEFINITIONS
OPENING
THICKNESS
275
m
375
m
Non solder mask
275
m × 275 m Sq. (rounded
1 oz max (32
m)
125
m thick
defined (NSMD)
corners)
(+0.0, –25
m)
(+0.0, –25
m)
(1)
Circuit traces from NSMD defined PWB lands should be 75
m to 100 m wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
(2)
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
(3)
Recommend solder paste is Type 3 or Type 4.
(4)
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
(5)
Solder mask thickness should be less than 20
m on top of the copper circuit pattern
(6)
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
(7)
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
Place all the external components very close to the TPA2016D2. Placing the decoupling capacitor, CS, close to
the TPA2016D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace
between the device and the capacitor can cause a loss in efficiency.
Recommended trace width at the solder balls is 75
m to 100 m to prevent solder wicking onto wider PCB
traces. For high current pins (PVDD (L, R), PGND, and audio output pins) of the TPA2016D2, use 100-
m trace
widths at the solder balls and at least 500-
m PCB traces to ensure proper performance and output power for
the device. For the remaining signals of the TPA2016D2, use 75-
m to 100-m trace widths at the solder balls.
The audio input pins (INR± and INL±) must run side-by-side to maximize common-mode noise cancellation
28
Copyright 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPA2016D2
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相關代理商/技術參數 |
參數描述 |
|---|---|
| TPA2016DYZHT2 | 制造商:Texas Instruments 功能描述: |
| TPA2017D2 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.8-W/Ch Stereo Class-D Audio Amplifier with SmartGainTM Dynamic Range Compression and AGC |
| TPA2017D2RTJEVM | 功能描述:音頻 IC 開發工具 TPA2017D2 Eval Mod RoHS:否 制造商:Texas Instruments 產品:Evaluation Kits 類型:Audio Amplifiers 工具用于評估:TAS5614L 工作電源電壓:12 V to 38 V |
| TPA2017D2RTJR | 功能描述:音頻放大器 2.8W/Ch Stereo Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA2017D2RTJT | 功能描述:音頻放大器 2.8W/Ch Stereo Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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