- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄98272 > TPA3002D2PHPRG4 (TEXAS INSTRUMENTS INC) 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PQFP48 PDF資料下載
參數(shù)資料
| 型號： | TPA3002D2PHPRG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻控制 |
| 英文描述： | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PQFP48 |
| 封裝： | GREEN, PLASTIC, HTQFP-48 |
| 文件頁數(shù)： | 21/40頁 |
| 文件大小： | 735K |
| 代理商： | TPA3002D2PHPRG4 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁當前第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁
TPA3002D2
SLOS402C DECEMBER 2002 REVISED JANUARY 2004
www.ti.com
28
Example. What is the maximum ambient temperature for an application that requires the TPA3002D2 to drive
7.5 W into stereo 8-
speakers?
PDissipated = 15 W × ((1 / 0.85) – 1) = 2.65 W
(PO = 7.5 W × 2)
TAmax = 150°C – (19°C/W × 2.65 W) =
99.65
°C
This calculation shows that the TPA3002D2 can drive 7.5 W into an 8-
speaker up to the absolute maximum
ambient temperature rating of 85
°C, which must never be exceeded.
Figure 38 and Figure 39 show the results of several thermal experiments conducted with the TPA3002D2. Both
figures show that the best thermal performance can be achieved with more copper area for heat dissipation
and an adequate number of thermal vias.
Figure 38 shows two curves for a 2-layer and 4-layer PCB. The 2-layer PCB layout was tightly controlled with
a fixed amount of 2 oz. copper on the bottom layer of the PCB. The amount of copper is shown on the x-axis.
Nine thermal vias of 13 mil (0,33 mm) diameter were drilled under the PowerPad and connected to the bottom
layer. The top layer only consisted of traces for signal routing.
The 4-layer PCB layout was also tightly controlled with a fixed amount of 2 oz. copper in middle GND layer. The
top layer only consisted of traces for signal routing. The bottom and other middle layer were left blank. Nine
thermal vias of 0,33 mm diameter were drilled under the PowerPAD and connected to the middle layer.
Figure 39 shows the effect of the number of thermal vias drilled under the PowerPAD on the thermal
performance of the PCB. The experiment was conducted with a 2-layer PCB and 3 square inches of copper
on the bottom layer. For the best thermal performance, at least 16 vias in a 4x4 pattern should be used under
the PowerPAD. Refer to the TPA3002D2 EVM User’s Manual (SLOU151), for an example layout with a 4x4
via pattern. PCB gerber files are available at request.
相關PDF資料 |
PDF描述 |
|---|---|
| TPA3002D2PHPG4 | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PQFP48 |
| TPA3003D2PFBR | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PQFP48 |
| TPA3003D2PFB | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PQFP48 |
| TPA3003D2PFBRG4 | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PQFP48 |
| TPA3003D2PFBG4 | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PQFP48 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TPA3003D2 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:3-Q STEREO CLASS-D AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL |
| TPA3003D2_06 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:3-Q STEREO CLASS-D AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL |
| TPA3003D2EVM | 功能描述:音頻 IC 開發(fā)工具 TPA3003D2 Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類型:Audio Amplifiers 工具用于評估:TAS5614L 工作電源電壓:12 V to 38 V |
| TPA3003D2PFB | 功能描述:音頻放大器 Ster Lo-Pwr Wide Sply Vltg Class-D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA3003D2PFBG4 | 功能描述:音頻放大器 Ster Lo-Pwr Wide Sply Vltg Class-D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復。