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| 型號： | TPA3106D1VFPRG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 40 W, 1 CHANNEL, AUDIO AMPLIFIER, PQFP32 |
| 封裝： | 7 X 7 MM, GREEN, PLASTIC, HLQFP-32 |
| 文件頁數(shù)： | 12/35頁 |
| 文件大小： | 1250K |
| 代理商： | TPA3106D1VFPRG4 |
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ABSOLUTE MAXIMUM RATINGS
TYPICAL DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
SLOS516B – OCTOBER 2007 – REVISED MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
VCC
Supply voltage
AVCC, PVCC
–0.3 V to 30 V
SHUTDOWN, MUTE
–0.3 V to VCC + 0.3 V
VI
Input voltage
GAIN0, GAIN1, INN, INP, MSTR/SLV, SYNC
–0.3 V to VREG + 0.5 V
Continuous total power dissipation
See Dissipation Rating Table
TA
Operating free-air temperature range
–40
°C to 85°C
TJ
Operating junction temperature range(2)
–40
°C to 150°C
Tstg
Storage temperature range
–65
°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
260
°C
RLoad
Load resistance
3.2
Minimum
Human body model (3) (all pins)
±2 kV
Electrostatic discharge
Charged-device model (4) (all pins)
±500 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The TPA3106D1 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection
shutdown. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad. See TI Technical
Briefs SLMA002 for more information about using the HTQFP thermal pad.
(3)
In accordance with JEDEC Standard 22, Test Method A114-B.
(4)
In accordance with JEDEC Standard 22, Test Method C101-A
PACKAGE(1)
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
32-pin VFP (HLQFP)
3.57 W
29 mW/
°C(2)
2.29 W
1.86 W
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad.
(2)
This data was taken using a 2 oz trace and copper pad that is soldered directly to a 2-layer high-k PCB (EVM) and they are typical
values. The thermal pad must be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SLMA002 for more
information about using the HLQFP thermal pad.
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
VCC
Supply voltage
PVCC, AVCC
10
26
V
VIH
High-level input voltage
SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV, SYNC
2
V
VIL
Low-level input voltage
SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV, SYNC
0.8
V
SHUTDOWN, VI = VCC, VCC = 24 V
125
MUTE, VI = VCC, VCC = 24 V
75
IIH
High-level input current
A
GAIN0, GAIN1, MSTR/SLV, SYNC, VI = VREG,
2
VCC = 24 V
SHUTDOWN, VI = 0, VCC = 24 V
2
IIL
Low-level input current
A
SYNC, MUTE, GAIN0, GAIN1, MSTR/SLV, VI = 0 V,
1
VCC = 24 V
VOH
High-level output voltage
FAULT, IOH = 1 mA
VREG – 0.6
V
VOL
Low-level output voltage
FAULT, IOL = -1 mA
AGND + 0.4
V
fOSC
Oscillator frequency
ROSC resistor = 100 k
200
300
kHz
TA
Operating free-air temperature
–40
85
°C
2
Copyright 2007, Texas Instruments Incorporated
Product Folder Link(s): TPA3106D1
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