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參數(shù)資料
型號: TPA5051RSAR
廠商: TEXAS INSTRUMENTS INC
元件分類: 消費(fèi)家電
英文描述: SPECIALTY CONSUMER CIRCUIT, PQCC16
封裝: 4 X 4 MM, GREEN, PLASTIC, QFN-16
文件頁數(shù): 17/23頁
文件大小: 812K
代理商: TPA5051RSAR
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
DATA1
BCLK1
LRCLK1
INPUT
BUFFER
OUTPUT
BUFFER
DATA_OUT1
CONTROL
2
3
I C
2
ADDx(2:0)
DELAY
MEMORY
DELAY
MEMORY
DATA2
BCLK2
LRCLK2
DATA_OUT2
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
SLOS497A – JUNE 2006 – REVISED JULY 2006
over operating free-air temperature (unless otherwise noted) (1)
VALUE
UNIT
VDD
Supply voltage
–0.3 to 3.6
V
VI
Input voltage
DATA, LRCLK, BCLK, SCL, SDA, ADD[2:0]
–0.3 to 5.5
V
Continuous total power dissipation
See Dissipation Rating Table
TA
Operating free-air temperature range
–40 to 85
°C
TJ
Operating junction temperature range
–40 to 125
°C
Tstg
Storage temperature range
–65 to 125
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
260
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE
TA≤ 25°C
DERATING
TA = 70°C
TA = 85°C
POWER RATING
FACTOR
POWER RATING
RSA
2.5 W
25 mW/
°C
1.375 W
1.0 W
(1)
This data was taken using 1 oz trace copper and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad
must be soldered to a thermal land on the printed-circuit board. See TI technical briefs SCBA01D and SLUA271 for more information
about using the QFN thermal pad.
MIN
MAX
UNIT
VDD
Supply voltage
VDD
3
3.6
V
VIH
High-level input voltage
DATA1, DATA2, LRCLK1, LRCLK2, BCLK1, BCLK2, SCL, SDA,
2
V
ADD[2:0]
VIL
Low-level input voltage
DATA1, DATA2, LRCLK1, LRCLK2, BCLK1, BCLK2, SCL, SDA,
0.8
V
ADD[2:0]
TA
Operating free-air temperature
–40
85
°C
3
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