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| 型號(hào)： | TPA6043A4RHB |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類(lèi)： | 音頻／視頻放大 |
| 英文描述： | 2.3 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC32 |
| 封裝： | PLASTIC, QFN-32 |
| 文件頁(yè)數(shù)： | 25/30頁(yè) |
| 文件大小： | 1112K |
| 代理商： | TPA6043A4RHB |
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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
SLOS543 – AUGUST 2007
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O/P
DESCRIPTION
NAME
NO.
ROUT+
20
O
Right-channel positive audio output
HP_EN
22
I
Headphone channel enable logic input; active high enable. HIGH=ENABLE.
SPKR_EN
23
I
Speaker channel enable logic input; active low enable. LOW=ENABLE.
BYPASS
24
P
Common-mode bias voltage for speaker preamplifiers
REG_EN
25
I
Enable pin (Active HIGH) for turning on/off LDO. HIGH=ENABLE
HP_INR
26
I
Headphone right-channel audio input
HP_INL
27
I
Headphone left-channel audio input
SGND
28
P
Signal ground, connect to CPGND and SPGND
REG_OUT
29
O
Regulated 3.3-V output
VDD
30
P
Positive power supply
GAIN0
31
I
Bit 0, MSB, of gain select bits
GAIN1
32
I
Bit 1, LSB, of gain select bits
Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is required for
Thermal Pad
Die Pad
P
mechanical stability and will enhance thermal performance.
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Supply voltage
HPVDD, VDD, SPVDD, CPVDD
–0.3 to 6
V
SPKR_LIN+, SPKR_LIN-, SPKR_RIN+, SPKR_RIN-,
–0.3 to 6.3
HP_EN,GAIN0, GAIN1, SPK_EN, REG_EN
VI
Input voltage
V
HP_INL, HP_INR HP Enabled
–3.5 to 3.5
HP_INL, HP_INR HP not Enabled
–0.3 to 3.5
Continuous total power dissipation
See Dissipation Rating Table
TA
Operating free-air temperature range
–40 to 85
°C
TJ
Operating junction temperature range
–40 to 150
°C
Tstg
Storage temperature range
–65 to 150
°C
Electrostatic discharge
HBM for HP_OUTL and HP_OUTR
8
kV
CDM
500
V
Electrostatic discharge,
all other pins
HBM
2
kV
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE(1)
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
RHB
5.06 W
40 mW/
°C
4.04 W
3.23 W
(1)
The PowerPAD must be soldered to a thermal land on the printed-circuit board. See the Texas Instruments document, PowerPAD
Thermally Enhanced Package application report (literature number SLMA002) for more information regarding the PowerPAD package.
MIN
MAX
UNIT
Supply voltage
VDD, SPVDD
4.5
5.5
V
Supply voltage
HPVDD, CPVDD
3
5.5
V
VIH
High-level input voltage
SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN
2
V
VIL
Low-level input voltage
SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN
0.8
V
4
Copyright 2007, Texas Instruments Incorporated
Product Folder Link(s): TPA6043A4
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