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參數資料
| 型號： | TPA751GQSR |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 音頻放大器 |
| 英文描述： | Amplifier. Other |
| 中文描述： | 放大器。其他 |
| 文件頁數： | 1/23頁 |
| 文件大小： | 362K |
| 代理商： | TPA751GQSR |
TPA751
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
WITH DIFFERENTIAL INPUTS
SLOS336C – DECEMBER 2000 – REVISED OCTOBER 2002
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Fully Specified for 3.3-V and 5-V Operation
Wide Power Supply Compatibility
2.5 V – 5.5 V
Power Supply Rejection at 217 Hz
– 84 dB at V
DD
= 5 V
– 81 dB at V
DD
= 3.3 V
Output Power for R
L
= 8
– 700 mW at V
DD
= 5 V
– 250 mW at V
DD
= 3.3 V
Ultralow Supply Current in Shutdown
Mode . . . 1.5 nA
Thermal and Short-Circuit Protection
Surface-Mount Packaging
– SOIC
– PowerPAD
MSOP
– MicroStar Junior
(BGA)
description
The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications
where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of
continuous power into a BTL 8-
load at less than 0.6% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as
wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. This device
features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.
The TPA751 is available in a 3.0
×
3.0 mm MicroStar Junior
(BGA), 8-pin SOIC surface-mount package and
a surface-mount PowerPAD
MSOP.
Audio
Input
Bias
Control
VDD
700 mW
6
5
7
VO+
VDD
1
2
4
BYPASS
IN –
VDD/2
CI
RI
CS
CB
RF
SHUTDOWN
VO–
8
GND
From System Control
3
IN+
–
+
–
+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
8
7
6
5
SHUTDOWN
BYPASS
IN+
IN–
V
O
–
GND
V
DD
V
O
+
D OR DGN PACKAGE
(TOP VIEW)
(SIDE VIEW)
MicroStar Junior (GQS) Package
(TOP VIEW)
SHUTDOWN
BYPASS
VO–
GND
VDD
VO+
IN+
IN–
NOTE: The shaded terminals are used for thermal
connections to the ground plane.
(E2
)
(
E3
)
(
E4
)
(
E5
)
(
A2
)
(
A3
)
(
A4
)
(
A5
)
PowerPAD and MicroStar Junior are trademarks of Texas Instruments.
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