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參數(shù)資料
型號: TPS61070DDC
廠商: Texas Instruments, Inc.
英文描述: 90% EFFICIENT SYNCHRONOUS BOOST CONVERTER WITH 600-mA SWITCH
中文描述: 90%高效同步升壓轉(zhuǎn)換器和600毫安開關(guān)
文件頁數(shù): 19/21頁
文件大小: 633K
代理商: TPS61070DDC
www.ti.com
C5
0.1
μ
F
DS1
C6
1
μ
F
V
CC2
~V
CC
Unregulated
Auxiliary Output
SW
C1
Power
Supply
L1
4.7
μ
H
VBAT
VOUT
FB
C2
EN
GND
TPS6107x
List of Components:
U1 = TPS61070DDC
L1 = Wurth Elektronik 744031004
C1 = 2 x 4.7 F, 0603, X7R/X5R Ceramic
C2 = 2 x 4.7 F, 0603, X7R/X5R Ceramic
V
CC
Boost Output
R1
R2
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
PD(MAX)
TJ(MAX)
TA
RJA
125
°
C
76
°
C W
85
°
C
520 mW
(8)
TPS61070
TPS61071
SLVS510–JUNE 2004
Figure 27. Power Supply Solution With Auxiliary Negative Output Voltage
Three basic approaches for enhancing thermal performance follow.
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (T
J
) of the TPS6107x devices is 125
°
C. The thermal
resistance of the 6-pin thin SOT package (DDC) is R
Θ
JA
= 76
°
C/W. Specified regulator operation is assured to a
maximum ambient temperature T
A
of 85
°
C. Therefore, the maximum power dissipation is about 520 mW. More
power can be dissipated if the maximum ambient temperature of the application is lower.
19
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