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參數(shù)資料
型號: TPS62301DRC
廠商: Texas Instruments, Inc.
英文描述: 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
中文描述: 500毫安,3 MHz的同步降壓轉換器芯片級封裝
文件頁數(shù): 21/31頁
文件大小: 1635K
代理商: TPS62301DRC
www.ti.com
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the
power-dissipation limits of a given component
PD(MAX)
TJ(MAX)
TA
RJA
125
°
C
250
°
C W
85
°
C
160 mW
(6)
CHIP SCALE PACKAGE DIMENSIONS
The TPS6230x, TPS6231x, and TPS6232x are also available in an 8-bump chip scale package (YZD,
NanoFree and YED, NanoStar). The package dimensions are given as:
D = 1.970
±
0.05 mm
E = 0.970
±
0.05 mm
TPS62300, TPS62301, TPS62302
TPS62303, TPS62305, TPS62311
TPS62313, TPS62320, TPS62321
SLVS528B–JULY 2004–REVISED JUNE 2005
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (T
J
) of the TPS6230x, TPS6231x, and TPS6232x devices is
125
°
C. The thermal resistance of the 8-pin CSP package (YZD and YED) is R
θ
JA
= 250
°
C/W. Specified regulator
operation is assured to a maximum ambient temperature T
of 85
°
C. Therefore, the maximum power dissipation
is about 160 mW. More power can be dissipated if the maximum ambient temperature of the application is lower
or if the PowerPAD package (DRC) is used.
21
相關PDF資料
PDF描述
TPS62301YZD 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62302DRC 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62302YZD 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62303DRC 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62303YZD 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
相關代理商/技術參數(shù)
參數(shù)描述
TPS62301DRCR 功能描述:直流/直流開關調節(jié)器 1.5V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62301DRCRG4 功能描述:直流/直流開關調節(jié)器 1.5V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62301YZDR 功能描述:直流/直流開關調節(jié)器 1.5V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62301YZDT 功能描述:直流/直流開關調節(jié)器 1.5V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62302DRCR 功能描述:直流/直流開關調節(jié)器 1.6V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
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