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參數(shù)資料
型號(hào)： TPS62321YED
廠商： Texas Instruments, Inc.
英文描述： 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
中文描述： 500毫安，3 MHz的同步降壓轉(zhuǎn)換器芯片級(jí)封裝
文件頁(yè)數(shù)： 21/31頁(yè)
文件大?。?/td> 1635K
代理商： TPS62321YED
www.ti.com
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the
power-dissipation limits of a given component
PD(MAX)
TJ(MAX)
TA
RJA
125
°
C
250
°
C W
85
°
C
160 mW
(6)
CHIP SCALE PACKAGE DIMENSIONS
The TPS6230x, TPS6231x, and TPS6232x are also available in an 8-bump chip scale package (YZD,
NanoFree and YED, NanoStar). The package dimensions are given as:
D = 1.970
±
0.05 mm
E = 0.970
±
0.05 mm
TPS62300, TPS62301, TPS62302
TPS62303, TPS62305, TPS62311
TPS62313, TPS62320, TPS62321
SLVS528B–JULY 2004–REVISED JUNE 2005
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (T
J
) of the TPS6230x, TPS6231x, and TPS6232x devices is
125
°
C. The thermal resistance of the 8-pin CSP package (YZD and YED) is R
θ
JA
= 250
°
C/W. Specified regulator
operation is assured to a maximum ambient temperature T
of 85
°
C. Therefore, the maximum power dissipation
is about 160 mW. More power can be dissipated if the maximum ambient temperature of the application is lower
or if the PowerPAD package (DRC) is used.
21
相關(guān)PDF資料
PDF描述
TPS62321YZD 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62311YZD 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62313YZD 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62320DRC 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62305DRC 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPS62321YEDR 功能描述:開(kāi)關(guān)變換器、穩(wěn)壓器與控制器 1.5V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開(kāi)關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel
TPS62321YEDT 功能描述:開(kāi)關(guān)變換器、穩(wěn)壓器與控制器 1.5V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開(kāi)關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel
TPS62321YZDR 功能描述:直流/直流開(kāi)關(guān)調(diào)節(jié)器 1.5V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開(kāi)關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62321YZDT 功能描述:直流/直流開(kāi)關(guān)調(diào)節(jié)器 1.5V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開(kāi)關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62350EVM-201 功能描述:電源管理IC開(kāi)發(fā)工具 STEP DOWN CONVERTER RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評(píng)估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V
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