
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
SLVS844 – SEPTEMBER 2008.......................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
OUTPUT CURRENT FOR DCDC
PACKAGE
TA
PART NUMBER (2)
QFN(2) PACKAGE
CONVERTERS
MARKING
–40°C to 85°C
TPS65055
2 × 600 mA
RSM
65055
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
The RSM package is available in tape and reel. Add R suffix (TPS65055RSMR) to order quantities of 3000 parts per reel. Add T suffix
(TPS65055RSMT) to order quantities of 250 parts per reel.
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Input voltage range on all pins except A/PGND, EN_LDO1 pins with respect to AGND
–0.3 to 7
V
Input voltage range on EN_LDO1 pins with respect to AGND
–0.3 to VCC+0.5
V
Output voltage range on LDO1, LDO2, LDO3, LDO4 pins with respect to AGND
–0.3 to 4.0
V
Current at VINDCDC1/2, L1, PGND1, L2, PGND2
1800
mA
Current at all other pins
1000
mA
Continuous total power dissipation
See Dissipation Rating Table
TA
Operating free-air temperature
–40 to 85
°C
TJ
Maximum junction temperature
125
°C
Tst
Storage temperature
–65 to 150
°C
Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds
260
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. This device
contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These circuits have
been qualified to protect this device against electrostatic discharges; HBM according to EIA/JESD22-A114-B: 1.5kV; and CDM
according EIA/JESD22C101C: 500V, however, it is advised that precautions should be taken to avoid application of any voltage higher
than maximum-rated voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together
or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic
voltage level, preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication
Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
PACKAGE
RθJA
POWER RATING
ABOVE TA = 25°C
POWER RATING
RSM(1)
58 K/W
1.7 W
17 mW/K
0.95 W
0.68 W
(1)
The thermal resistance junction-to-case of the RSM package is 4 K/W measured on a high K board.
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VINDCDC1/2
Input voltage range for step-down converters
2.5
4
6.0
V
VDCDC1
Output voltage range for VDCDC1 step-down converter
0.6
VINDCDC1
V
VDCDC2
Output voltage range for VDCDC2 step-down converter
0.6
VINDCDC2
V
VINLDO1, VINLDO2,
Input voltage range for LDOs
1.5
6.5
V
VINLDO3/4
VLDO1-3
Output voltage range for LDO1 and LDO3
0.8
2.8
V
VLDO2-4
Output voltage range for LDO2 and LDO4
1.0
3.0
V
2
Copyright 2008, Texas Instruments Incorporated