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參數(shù)資料
| 型號： | TPS75133QPWPRQ1 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | CB 2C 2#0 PIN RECP WALL |
| 中文描述： | 快速瞬態(tài)響應1.5低壓差電壓調(diào)節(jié)器 |
| 文件頁數(shù)： | 24/27頁 |
| 文件大小： | 398K |
| 代理商： | TPS75133QPWPRQ1 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁當前第24頁第25頁第26頁第27頁
TPS75101-Q1,
’
75115-Q1,
’
75118-Q1,
’
75125-Q1,
’
75133-Q1 WITH POWER GOOD
TPS75301-Q1, TPS75315-Q1, TPS75318-Q1, TPS75325-Q1, TPS75333-Q1 WITH RESET
FAST-TRANSIENT-RESPONSE 1.5-A LOW-DROPOUT VOLTAGE REGULATORS
SGLS159
–
APRIL 2003
24
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
thermally enhanced TSSOP-20 (PWP
–
PowerPad
) (continued)
Figure 28 is an example of a thermally enhanced PWB layout for use with the new PWP package. This board
configuration was used in the thermal experiments that generated the power ratings shown in Figure 26 and Figure
27. As discussed earlier, copper has been added on the PWB to conduct heat away from the device. R
θ
JA
for this
assembly is illustrated in Figure 26 as a function of heat-sink area. A family of curves is included to illustrate the effect
of airflow introduced into the system.
Board thickness
Board size
Board material
Copper trace/heat sink
Exposed pad mounting
62 mils
3.2 in.
×
3.2 in.
FR4
1 oz
63/67 tin/lead solder
Heat-Sink Area
1 oz Copper
Figure 28. PWB Layout (Including Copper Heatsink Area) for Thermally Enhanced PWP Package
From Figure 26, R
θ
JA
for a PWB assembly can be determined and used to calculate the maximum power-dissipation
limit for the component/PWB assembly, with the equation:
PD(max)
TJmax
RJA(system)
TA
Where:
(5)
T
J
max is the maximum specified junction temperature (150
°
C absolute maximum limit, 125
°
C recommended
operating limit) and T
A
is the ambient temperature.
P
D(max)
should then be applied to the internal power dissipated by the TPS75133QPWP regulator. The equation
for calculating total internal power dissipation of the TPS75133QPWP is:
PD(total)
VI
VO
IO
VI
IQ
(6)
Since the quiescent current of the TPS75133QPWP is very low, the second term is negligible, further simplifying
the equation to:
PD(total)
VI
VO
IO
(7)
For the case where T
A
= 55
°
C, airflow = 200 ft/min, copper heat-sink area = 4 cm
2
, the maximum power-dissipation
limit can be calculated. First, from Figure 26, we find the system R
θ
JA
is 50
°
C/W; therefore, the maximum
power-dissipation limit is:
PD(max)
TJmax
RJA(system)
TA
125 C
50 C W
55 C
1.4 W
(8)
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| TPS75201MPWPREP | 功能描述:低壓差穩(wěn)壓器 - LDO Mil Enh Fast Trans Resp Vltg Regs RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75201QPWP | 功能描述:低壓差穩(wěn)壓器 - LDO Fast-Tran-Resp 2-A RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75201QPWPG4 | 功能描述:低壓差穩(wěn)壓器 - LDO Fast-Tran-Resp 2-A RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75201QPWPR | 功能描述:低壓差穩(wěn)壓器 - LDO Fast-Tran-Resp 2-A RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75201QPWPREP | 功能描述:低壓差穩(wěn)壓器 - LDO Mil Enh Fast Trans Resp Vltg Regs RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
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