
VIN
SW
FB
MODE
GND
EN
VOUT
1.8 V @ 600mA
C
I
TPS82671SIP
L
VIN
2.3 V .. 4.8 V
C
O
MODE
SELECTION
ENABLE
DC/DC Converter
GND
250
225
200
175
150
125
100
75
50
25
0
100
90
80
70
60
50
40
30
20
10
0
0.1
1
10
100
1000
I - Load Current - mA
O
Power
Loss
-
mW
Efficiency
-
%
V = 3.6 V,
V = 1.8 V
I
O
Efficiency
PFM/PWM Operation
Power Loss
PFM/PWM Operation
SLVSAI0A
– OCTOBER 2010 – REVISED APRIL 2011
600-mA, HIGH-EFFICIENCY MicroSiP
STEP-DOWN CONVERTER (PROFILE <1.0mm)
1
FEATURES
DESCRIPTION
23
90% Efficiency at 5.5MHz Operation
The TPS8267x device is a complete 600mA, DC/DC
17
μA Quiescent Current
step-down power supply intended for low-power
applications.
Included
in
the
package
are
the
Wide VIN Range From 2.3V to 4.8V
switching
regulator,
inductor
and
input/output
5.5MHz Regulated Frequency Operation
capacitors. No additional components are required to
Spread Spectrum, PWM Frequency Dithering
finish the design.
Best in Class Load and Line Transient
The
TPS8267x
is
based
on
a
high-frequency
±2% Total DC Voltage Accuracy
synchronous step-down dc-dc converter optimized for
battery-powered
portable
applications.
The
Automatic PFM/PWM Mode Switching
MicroSiPTM DC/DC converter operates at a regulated
Low Ripple Light-Load PFM Mode
5.5-MHz
switching
frequency
and
enters
the
≥35dB VIN PSRR (1kHz to 10kHz)
power-save mode operation at light load currents to
Internal Soft Start, 120-
s Start-Up Time
maintain high efficiency over the entire load current
range.
Integrated Active Power-Down Sequencing
(Optional)
The PFM mode extends the battery life by reducing
the quiescent current to 17
μA (typ) during light load
Current Overload and Thermal Shutdown
operation. For noise-sensitive applications, the device
Protection
has PWM spread spectrum capability providing a
Sub 1-mm Profile Solution
lower noise regulated output, as well as low noise at
Total Solution Size
<6.7 mm2
the input. These features, combined with high PSRR
and AC load regulation performance, make this
device suitable to replace a linear regulator to obtain
APPLICATIONS
better power conversion efficiency.
Cell Phones, Smart-Phones
The TPS8267x is packaged in a compact (2.3mm x
Digital TV, WLAN, GPS and Bluetooth
2.9mm) and low profile (1.0mm) BGA package
Applications
suitable for automated assembly by standard surface
POL Applications
mount equipment.
Figure 1. Typical Application
Figure 2. Efficiency vs. Load Current
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
MicroSiP is a trademark of Texas Instruments.
3
Bluetooth is a trademark of Bluetooth SIG, Inc.
UNLESS
OTHERWISE
NOTED
this
document
contains
Copyright
2010–2011, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.