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參數資料
| 型號： | TS4995EIJT |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.2 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9 |
| 封裝： | LEAD FREE, FCP-9 |
| 文件頁數： | 16/26頁 |
| 文件大小： | 440K |
| 代理商： | TS4995EIJT |
TS4995
Package information
23/26
5
Package information
T
o meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 59.
9-bump flip-chip package mechanical drawing
Figure 60.
Tape and reel schematics
1.63 mm
0.5mm
0.25mm
1.63 mm
0.5mm
0.25mm
600m
– Die size: 1.63mm x 1.63mm ± 30m
– Die height (including bumps): 600m
– Bumps diameter: 315m ±50m
– Bump diameter before reflow: 300m ±10m
– Bumps height: 250m ±40m
– Die height: 350m ±20m
– Pitch: 500m ±50m
– Coplanarity: 60m max
User direction of feed
A
1
A
1
8
Die size X + 70m
Die
siz
e
Y
+
70
m
4
1.5
4
All dimensions are in mm
User direction of feed
A
1
A
1
8
Die size X + 70m
Die
siz
e
Y
+
70
m
4
1.5
4
All dimensions are in mm
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相關代理商/技術參數 |
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| TS4998IQT | 功能描述:音頻放大器 2X1W Differential Input Audio Amp RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TS4999 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:Filter-free stereo 2.8 W class D audio power amplifier with selectable 3D sound effects |
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