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參數資料
| 型號： | TS8388BCG |
| 廠商： | E2V TECHNOLOGIES PLC |
| 元件分類： | ADC |
| 英文描述： | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA72 |
| 封裝： | 1.27 MM PITCH, HEAT SINK, CERAMIC, BGA-72 |
| 文件頁數： | 7/43頁 |
| 文件大小： | 1530K |
| 代理商： | TS8388BCG |
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Product Specification
TS8388BG
4.5.
THERMAL AND MOISTURE CHARACTERISTICS
4.5.1.
THERMAL RESISTANCE FROM JUNCTION TO AMBIENT : RTHJA
The following table lists the convector thermal performances parameters of the device itself, with no external heatsink added.
4.5.2.
THERMAL RESISTANCE FROM JUNCTION TO CASE : RTHJC
Typical value for Rthjc is given to 1.56°C/W.
This value does not include thermal contact resistance between package and external component (heatsink or PCBoard).
As an example, 2.0°C/W can be taken for 50 m of thermal grease.
4.5.3.
CBGA72 BOARD ASSEMBLY WITH EXTERNAL HEATSINK
It is recommended to use an external heatsink or PCBoard special design.
Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated in the device.
Note: The measures are given in mm.
4.5.4.
MOISTURE CHARACTERISTICS
This device is very sensitive to the moisture (MSL6 according JEDEC standard).
When receiving the devices (in dry pack), you must follow strictly the instructions on the sticker.
The devices must be mounted within 6 hours at factory conditions of
≤ 30°C/60% RH.
These devices, if subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. 220
°C), must be baked
before mounting for :
-
192 hours at 40
°C + 5°C/-0°C and <5% RH for low-temperature device containers, or
-
24 hours at 125
°C ± 5°C for high-temperature device containers.
Note : in case of reworking of a component on a board containing this device, the board could need to be heated. In this case and to preserve
the TS8388BG, it is important to bake the board first, according to the instructions above.
0
10
20
30
40
50
0
1
23
45
Air flow (m/s)
Rthja
(deg.C/W)
Air flow
Estimated ja thermal resistance
(m/s)
(
oC / W)
045
0,5
35,8
1
30,8
1,5
27,4
2
24,9
2,5
23
3
21,5
4
19,3
5
17,7
相關PDF資料 |
PDF描述 |
|---|---|
| TS8388BCG | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA72 |
| TS8388BMFB/T | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
| TS8388BMFSB/T | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
| TS8388BMFSB/Q | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
| TS8388BMFB/Q | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TS8388BCGL | 制造商:e2v technologies 功能描述:ADC 8-BIT 1 GSPS - Trays |
| TS8388BCGL (+LID) | 制造商:e2v technologies 功能描述:ADC 8-BIT 1 GSPS - Trays |
| TS8388BMF | 制造商:e2v technologies 功能描述:ADC 8-BIT 1 GSPS - Trays |
| TS8388BMFB/Q | 制造商:e2v technologies 功能描述:ADC 8-BIT 1 GSPS - Trays |
| TS8388BMFS | 制造商:e2v technologies 功能描述:ADC 8-BIT 1 GSPS - Trays |
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