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參數資料
| 型號： | TSC2008IYZGT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, BGA12 |
| 封裝： | 2 X 1.50 MM, GREEN, DSBGA-12 |
| 文件頁數： | 12/40頁 |
| 文件大小： | 1028K |
| 代理商： | TSC2008IYZGT |
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ABSOLUTE MAXIMUM RATINGS
(1)
SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TYPICAL
NO MISSING
INTEGRAL
GAIN
CODES
SPECIFIED
TRANSPORT
LINEARITY
ERROR
RESOLUTION
PACKAGE
TEMPERATURE
PACKAGE
ORDERING
MEDIA,
PRODUCT
(LSB)
(BITS)
TYPE
DESIGNATOR
RANGE
MARKING
NUMBER
QUANTITY
Small Tape
TSC2008IRGVT
16-Pin,
and Reel, 250
4 x 4
RGV
–40°C to +85°C
TSC2008I
Tape and
QFN
TSC2008IRGVR
Reel, 2500
TSC2008
±1.5
0.7
11
Small Tape
12-Pin,
TSC2008IYZGT
and Reel, 250
3 x 4 Matrix,
YZG
–40°C to +85°C
TSC2008I
1.5 x 2
Tape and
TSC2008IYZGR
WCSP
Reel, 3000
(1)
For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
TSC2008
UNIT
Analog input X+, Y+, AUX to GND
–0.4 to VDD + 0.1
V
Voltage
Analog input X–, Y– to GND
–0.4 to VDD + 0.1
V
Voltage range
VDD to GND
–0.3 to +5
V
Digital input voltage to GND
–0.3 to VDD + 0.3
V
Digital output voltage to GND
–0.3 to VDD + 0.3
V
Power dissipation
(TJ Max - TA)/θJA
QFN package
47
°C/W
Thermal impedance,
θ
JA
Low-K
113
°C/W
WCSP
High-K
62
°C/W
Operating free-air temperature range, TA
–40 to +85
°C
Storage temperature range, TSTG
–65 to +150
°C
Junction temperature, TJ Max
+150
°C
Vapor phase (60 sec)
+215
°C
Lead temperature
Infrared (15 sec)
+220
°C
IEC contact discharge(2)
X+, X–, Y+, Y–
±15
kV
IEC air discharge(2)
X+, X–, Y+, Y–
±25
kV
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
(2)
Test method based on IEC standard 61000-4-2. Device powered by battery. Contact Texas Instruments for test details.
2
Copyright 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TSC2008
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