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參數資料
型號: TSF
英文描述: (662.18 k)
中文描述: (662.18十一)
文件頁數: 18/22頁
文件大小: 662K
代理商: TSF
18
Lead wire process
G
When bending the lead wire, in order to protect the resin seal from excessive pressure, secure
the lead wire cIose to the case and bend the part beyond the secured section.
3 mmor more
Secured
Secured
0.8 steel wire
SF(10 kgf)
SM(5 kgf)
φ
The lead wire should be bent at a distance 3 mm or more from the body of the fuse, and should
not be twisted.
G
The tensile strength applied to the lead wire should be 5 kg or less for the SF type, and 1 kg or
less for the SM type.
G
The strength applied to the body of the thermal cutoff should be 10 kg or less for the SF type, and
5 kg or less for the SM type.
In the case of an SF type, deformation of the case may change the location of the moving
electrode during operation and may cause the thermal cutoff to operate only at temperatures
lower than the normal operating temperature range. The thermal cutoff also may not operate
even if the thermal cutoff's operating temperature is exceeded.
Mounting
SEFUSE can be mounted by soldering, caulking, or welding.
G
If soldering, note that the thermal cutoff may not function because of excessive solder
temperature.
To prevent such malfunctions, for example, holding the lead new the case by a tool is effective
for allowing the heat to escape, and the soldering should be done in short interval.
Another effective method is to use a lower solder temperature and to solder at a location that is
distant from the case.
G
If caulking or welding, be careful to keep the resistance value of the connecting section low.
If the connecting section has a high resistance value, the passing current may generate an
abnormally high temperature that will cause the thermal cutoff to operate (break the circuit).
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