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參數(shù)資料
| 型號： | TSL237T |
| 廠商： | AMS-TAOS USA Inc |
| 文件頁數(shù)： | 10/13頁 |
| 文件大小： | 621K |
| 描述： | IC LIGHT TO FREQUENCY CONV 4-TMB |
| 標準包裝： | 1 |
| 傳感器類型： | 光轉(zhuǎn)頻率轉(zhuǎn)換器 |
| 輸出類型： | 數(shù)字 |
| 其它名稱： | TSL237-TDKR |
TSL237T
HIGH-SENSITIVITY
LIGHT-TO-FREQUENCY CONVERTER
TAOS055J DECEMBER 2007
9
The LUMENOLOGY r Company
r
r
Copyright E 2007, TAOS Inc.
www.taosinc.com
MANUFACTURING INFORMATION
The reflow profile specified here describes expected maximum heat exposure of devices during the solder
reflow process of the device on a PWB. Temperature is measured at the top of the device. Devices should be
limited to one pass through the solder reflow profile.
Table 1. TSL237T Solder Reflow Profile
PARAMETER
REFERENCE
TSL237T
Average temperature gradient in preheating
2.5癈/sec
Soak time
t
soak
2 to 3 minutes
Time above T
1
, 217癈
t
1
Max 60 sec
Time above T
2
, 230癈
t
2
Max 50 sec
Time above T
3
, (T
peak
10?/SPAN>C)
t
3
Max 10 sec
Peak temperature in reflow
T
peak
260?C (0癈/+5癈)
Temperature gradient in cooling
Max 5癈/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale for reference only
Time (sec)
Figure 13. TSL237T Solder Reflow Profile
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