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參數資料
| 型號： | TSL238D-TR |
| 廠商： | AMS-TAOS USA Inc |
| 文件頁數： | 12/13頁 |
| 文件大小： | 589K |
| 描述： | IC LIGHT TO FREQUENCY CONV 8SOIC |
| 標準包裝： | 1 |
| 系列： | * |
| 其它名稱： | TSL238-D-TRDKR TSL238-D-TRDKR-ND |
TSL238
HIGH-SENSITIVITY
LIGHT-TO-FREQUENCY CONVERTER
TAOS073J SEPTEMBER 2008
11
The LUMENOLOGY r Company
r
r
Copyright E 2008, TAOS Inc.
www.taosinc.com
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound. To prevent
these adverse conditions, all devices shipped in carrier tape have been pre-baked and shipped in a sealed
moisture-barrier bag. No further action is necessary if these devices are processed through solder reflow within
24 hours of the seal being broken on the moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours
or longer, it is recommended that the following procedures be used to ensure the package molding compound
contains the smallest amount of absorbed moisture possible.
For devices shipped in tubes:
1. Remove devices from tubes
2. Bake devices for 4 hours, at 90癈
3. After cooling, load devices back into tubes
4. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re-baked for 4 hours, at 90癈 for a cumulative total of 12 hours (3 bakes for 4 hours at 90癈).
For devices shipped in carrier tape:
1. Bake devices for 4 hours, at 90癈 in the tape
2. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
rebaked for 4 hours in tape, at 90癈 for a cumulative total of 12 hours (3 bakes for 4 hours at 90癈).
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