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參數資料
| 型號： | TSPDMEDA001-75 |
| 廠商： | Microsemi Corporation |
| 英文描述： | PRODUCT CAPABILITY SHEET |
| 中文描述： | 產品性能資料 |
| 文件頁數： | 1/1頁 |
| 文件大小： | 24K |
| 代理商： | TSPDMEDA001-75 |
PRODUCT
CAPABILITY
SHEET
Monolithic Flip Chip
Thyristor Surge
Protection Device
Array
for Implantable
Applications
Performance Advantages
50% real estate reduction over competition
On State Dissipation is 1.5 to 2 times less than competition
Switching Characteristics - (ton) - up to 10 times faster
Can handle 3 times the surge as competition for the same physical area
Custom designs in 3-4 weeks (competition does not offer custom arrangements)
Features
Monolithic Flip Chip Construction, all contacts on one side
Available with solderable surface
Common Anode/Cathode available
Available in 2, 3, 4, 5, 6, 8 element arrays (see outlines below)
Available in 5-8.5 Volt versions
Power Rating is 50 Joules at 37
°
C
Also available in TVS (TVSMEDA Series)
Proposed Maximum Ratings @ 37
°
C-Body Temperature (unless otherwise specified)
2830 S. Fairview St.
Santa Ana, CA 92704
PH: (714) 979-8220
FAX: (714) 966-5256
Part Number
V
DRM
V
Z
V
BO
I
BO
I
H
V
T
V
T
I
TSM
I
R
t
on
V
C
C
O
@1 A @8 A
Volts
MAX
3
3
3
@ VWM
nA
MAX
100
100
100
1kV/us @ 50
@ 0V
Volts
MAX
10
15
15
Volts
MAX
5
7.5
8.5
Volts Volts
MIN
6
8
9
mA
MAX
20
20
20
mA
MIN
1
1
1
Volts
MAX
6
6
6
Amps
MAX
30
30
30
nsec
MAX
500
500
500
pF
MAX
100
100
100
MAX
8
12
12
TSPDMEDA001-5
TSPDMEDA001-7.5
TSPDMEDA001-8.5
MSC0988.PDF
2
M
5
M
2 mm
Max
2 mm
Max
Input
Elementary
Cell
Schematic
Monolithic Flip Chip Configurations
(in development)
These Monolithic Arrays will feature
multiple devices on one chip with all
contacts on one surface. The
surfaces are available with a
solderable metal contact.
For more information on these
devices contact Microsemi's Santa
Ana division for custom
configurations and designs.
Common
Cathode
Common
Anode
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