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參數資料
| 型號： | TXB2P-019-028ND |
| 廠商： | CTS Thermal Management Products |
| 文件頁數： | 1/2頁 |
| 文件大?。?/td> | 0K |
| 描述： | THERMAL LINK PRESS ON NICKEL TO- |
| 產品目錄繪圖： | TX(B2)P Series |
| 標準包裝： | 100 |
| 類型： | 頂部安裝 |
| 冷卻式包裝： | TO-18 |
| 固定方法： | 壓配合，螺栓緊固 |
| 形狀： | 圓柱 |
| 長度： | 0.280"（7.11mm） |
| 寬： | 0.220"（5.59mm） |
| 直徑： | 0.220"（5.59mm）外徑 |
| 自然環境下的熱電阻： | 108°C/W |
| 材質： | 黃銅 |
| 材料表面處理： | 啞鎳 |
| 其它名稱： | 294-1141 |
18
iZIF HEAT FRAME
GENERAL DESCRIPTION
The iZIF is a custom aluminum heat frame that integrates
the PCB retainer for improved structural integrity and thermal
efficiency (.8°C-in./W). The iZIF is a highly reliable patent-
pending design for rugged military and aerospace circuit card
applications. It features a quarter-turn lock, uniform clamping
pressure, and can be sized to fit small daughter cards up to
9U VME. A bottom plate may also be added for additional
cooling and structural integrity. The iZIF features a 1/8”
stainless steel socket head cap rod with beryllium copper
spring. A variety of finishes are available such as chemical
film, black anodize, and electroless nickel.
THERMAL LINKS
GENERAL DESCRIPTION
CTS’s thermal links provide superior retention because
of the 6 to 8-segment fingers versus the 2 or 3-segment
fingers available from other manufacturers. These thermal
links are offered for TO-5s, TO-8s and TO-18s with or
without BeO washer and other appropriate hardware.
They provide an effective retainer and efficient thermal
path between semiconductor and heat sinks or chassis.
There is excellent transistor retention under high
vibration and shock loads. The thermal links can be
inserted and removed multiple times without loss of
retention or damage to the finish over the entire JEDEC
case diameter range. They can be installed with a rivet or
eyelet, soldered to a PC pad or heat sink, mounted with a
single screw or with a threaded stud and hex nut.
FAN TOP SERIES
A
B
“A”
“B”
Semiconductor
Part Number
Dim.
Case Type
* °C/W
Unplated
Black Cadmium
Black Chem.
Material
.25
.50
TO-18
150.0
TXBF-019-025U
TXBF-019-025B
N.A.
BeCu
.25
.50
TO-18
150.0
TXCF-019-025U
N.A.
TXCF-019-025CB
Brass
.25
.75
TO-5
81.1
TXBF-032-025U
TXBF-032-025B
N.A.
BeCu
.25
.75
TO-5
81.1
TXCF-032-025U
N.A.
TXCF-032-025CB
Brass
.36
1.25
TO-5
57.7
TXBF2-032-036U
TXBF2-032-036B
N.A.
Brass Fan
BeCu Retainer
.33
1.25
TO-8
41.0
TXBF2-050-033U
TXBF2-050-033B
N.A.
Brass Fan
BeCu Retainer
.12
1.25
TO-5
56.6
TXCF-125-1U
TXCF-125-1CB
N.A.
Brass
.12
1.25
TO-8
56.6
TXCF-125-2U
TXCF-125-2B
N.A.
Brass
Fan Tops
*Natural convection, case-ambient mounted on G10 board
CTS
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| TXB2P-032-037ND | THERMAL LINK PRESSON NKL TO-5 |
| 3-5179030-0 | CONN PLUG 200POS FH .8MM BRD-BRD |
| TXB2P-032-037B | THERMAL LINK PRESSON BLK TO-5 |
| 4-5353190-0 | CONN RCPT 140POS DL VERT 0.6MM |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TXB2P032037B | 功能描述:散熱片 TO-5 4-40 screw mt. RoHS:否 制造商:Ampro By ADLINK 產品:Heat Sink Accessories 安裝風格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設計目的:Express-HRR |
| TXB2P-032-037B | 功能描述:THERMAL LINK PRESSON BLK TO-5 RoHS:否 類別:風扇，熱管理 >> 熱敏 - 散熱器 系列:- 產品目錄繪圖:BDN12-3CB^A01 標準包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類（BGA，LGA，CPU，ASIC……） 固定方法:散熱帶，粘合劑（含） 形狀:方形，鰭片 長度:1.21"（30.73mm） 寬:1.210"（30.73mm） 直徑:- 機座外的高度（散熱片高度）:0.355"（9.02mm） 溫升時的功耗:- 在強制氣流下的熱敏電阻:在 400 LFM 時為6.8°C/W 自然環境下的熱電阻:19.6°C/W 材質:鋁 材料表面處理:黑色陽極化處理 產品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099 |
| TXB2P-032-037ND | 功能描述:散熱片 RoHS:否 制造商:Ampro By ADLINK 產品:Heat Sink Accessories 安裝風格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設計目的:Express-HRR |
| TXB2P-045-037B | 制造商:CTS Corporation 功能描述:TXB2P Series TO-5 Case Type Black Cad. Finish Heat Sink Elect. Component |
| TXB2P-050-037LI | 制造商:CTS Corporation 功能描述:TX Series Thermal Link Retainers Without BeO Insulator |
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